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Multi-hole glue-dispensing die bonder

A die-bonding machine and glue-dispensing technology, applied in electrical components, circuits, semiconductor devices, etc., to solve problems such as offset or falling off, insufficient contact between the glue point and the LED chip, and insufficient contact between the glue point and the bottom of the LED chip. , to avoid offset or fall off, enhance heat dissipation performance, and save the amount of glue

Inactive Publication Date: 2013-12-18
SHENZHEN LT OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the insufficient contact between the glue point and the bottom of the LED chip and the insufficient bonding strength between the LED chip and the LED bracket when the existing single-hole dispensing die-bonding machine is used for die-bonding, the LED chip will be deflected in the subsequent processes such as wire bonding. shifting or falling off, and the insufficient contact between the glue point and the LED chip, which affects the heat dissipation effect of the LED chip and other technical problems. Porous Dispensing and Die Bonding Machine for Strength and Improved LED Heat Dissipation

Method used

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] see Figure 4 , is a schematic diagram of the main module structure of a crystal bonder 10 with multiple glue outlets provided in the first embodiment of the present invention, which includes a control system (not labeled), a glue dispensing robot arm 108, and a crystal removal robot arm 109, a feeding mechanism (not labeled), a discharging mechanism (not labeled), the feeding mechanism and the discharging mechanism are installed in the chassis (not shown), and an LED chip tray (not shown) is placed on the feeding mechanism ), an LED bracket plate (not shown) is placed on the discharge m...

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Abstract

The invention discloses a multi-hole glue-dispensing die bonder comprising a glue-dispensing manipulator. The glue-dispensing manipulator comprises a glue-dispensing needle in a thing shaft shape, the middle of the glue-dispensing needle is provided with a through hole, the end of the through hole is provided with at least two glue-dispensing holes distributed in arrays, and the entire distributing shape corresponds to the shape of the bottom of an LED chip. The multi-hole glue-dispensing die bonder is provided with multiple glue-dispensing holes, so that the dispensed glue covers the entire bottom of the LED chip basically, the glue overflows less, combination force between the LED chip and an LED rack is enhanced, using amount of the glue is saved, and radiating property of the LED is further enhanced.

Description

【Technical field】 [0001] The invention relates to a crystal bonding machine, in particular to a porous glue dispensing crystal bonding machine. 【Background technique】 [0002] When LED (Light Emitting Diode) is bonded, it mainly includes processes such as dispensing, suction, placement, bonding, wire bonding, and packaging. The dispensing process is realized by a dispensing robot arm. The dispensing robot arm includes a dispensing needle. The glue needle is pressed to squeeze out the glue. The process of crystal suction and crystal release is realized by a crystal suction mechanical arm. The crystal suction mechanical arm includes a crystal suction needle, and there is a vacuum in the crystal suction needle. After the LED chip is sucked, it moves to the top of the LED bracket and puts down the LED chip. The welding wire is to connect the positive and negative poles of the LED chip to the positive and negative poles of the LED bracket. This process will cause the LED chip t...

Claims

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Application Information

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IPC IPC(8): H01L33/00B05C5/00
Inventor 王磊
Owner SHENZHEN LT OPTOELECTRONICS CO LTD