A method for preparing a large-area and small-size core-shell structure silicon nanowire array
A technology of silicon nanowire array and core-shell structure, applied in nanotechnology, nano-optics, nanotechnology, etc., can solve the limitation of silicon nanowire array area and aspect ratio, many structural defects of silicon nanowire, and difficult silicon-based light emission Devices and other problems, to achieve strong controllability of aspect ratio, improve single-layer performance and close packing, and good controllability
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Embodiment 1
[0037] 1. Pretreatment of silicon wafers:
[0038] Cut a p-type silicon substrate with a resistivity of 15-20Ωcm and a crystallographic orientation of (100) into 3cm×3cm square pieces, ultrasonically clean them one by one with acetone, alcohol, and deionized water, and immerse them in concentrated H 2 SO 4 (mass fraction 98%) and H 2 o 2 (mass fraction 30%) in a mixed solution with a volume ratio of 4:1, heat preservation at 135 degrees Celsius for 1 hour to carry out hydrophilic treatment, and store it in the above mixed solution after cooling for subsequent use;
[0039] 2. The preparation of a single-layer close-packed PS bead array, the process is as follows figure 1 shown.
[0040] (1) Ultrasound the PS pellet solution with a diameter of 250nm and a mass fraction of 10% for 5 minutes for preliminary dispersion, mix and dilute the PS pellet solution with deionized water until the mass fraction is 0.3%, and then take the diluted PS pellet The solution is mixed with alc...
Embodiment 2
[0063] 1. Pretreatment of silicon wafers:
[0064] Cut a p-type silicon substrate with a resistivity of 15-20Ωcm and a crystallographic orientation of (100) into 3cm×3cm square pieces, ultrasonically clean them one by one with acetone, alcohol, and deionized water, and immerse them in concentrated H 2 SO 4 (mass fraction 98%) and H 2 o 2 (mass fraction 30%) in a mixed solution with a volume ratio of 4:1, heat preservation at 135 degrees Celsius for 1 hour to carry out hydrophilic treatment, and store it in the above mixed solution after cooling for subsequent use;
[0065] 2. Preparation of single-layer close-packed PS bead array:
[0066] (1) Ultrasound the PS pellet solution with a diameter of 250nm and a mass fraction of 10% for 5 minutes for preliminary dispersion, mix and dilute the PS pellet solution with deionized water until the mass fraction is 0.5%, and then take the diluted PS pellet solution The solution is mixed with alcohol at a volume ratio of 1:0.8, and fin...
Embodiment 3
[0088] 1. Pretreatment of silicon wafers:
[0089] Cut a p-type silicon substrate with a resistivity of 15-20Ωcm and a crystallographic orientation of (100) into 3cm×3cm square pieces, ultrasonically clean them one by one with acetone, alcohol, and deionized water, and immerse them in concentrated H 2 SO 4 (mass fraction 98%) and H 2 o 2 (mass fraction 30%) in a mixed solution with a volume ratio of 4:1, heat preservation at 135 degrees Celsius for 1 hour to carry out hydrophilic treatment, and store it in the above mixed solution after cooling for subsequent use;
[0090] 2. Preparation of single-layer close-packed PS bead array:
[0091] (1) Ultrasound the PS pellet solution with a diameter of 250nm and a mass fraction of 10% for 5 minutes for preliminary dispersion, mix and dilute the PS pellet solution with deionized water until the mass fraction is 0.4%, and then take the diluted PS pellet The solution is mixed with alcohol at a volume ratio of 1:1.2, and finally the ...
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