Portable electronic communication device and manufacturing method thereof
A technology of a communication device and a manufacturing method, which is applied to the structure of a telephone set, a portable casing, etc., can solve the problems of bending or breakage of a circuit substrate, low impact strength, etc., and achieves enhanced drop durability, reduced impact energy, and high impact resistance. The effect of strength and durability
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Embodiment 1)
[0077] A composite resin composition was produced, including: 40% by weight of PS-971 (Aekyung Chemical) as an unsaturated polyester; 7% by weight of tert-butyl hydroperoxide (Heiwa Pharmaceutical) as a peroxide-based curing agent 2% by weight of BYK9076 (BYK Chemie Corporation) as impregnation improver; 50% by weight of chopped glass fibers; and 1% by weight of additives.
[0078] The composite resin composition produced above was put into a metal lower mold. Later, for electronic communication devices such as image 3 As shown, a circuit board on which electronic components, positive-side terminals and negative-side terminals are formed and core blocks are bonded is stacked on the lower mold. After that, the manufactured composite resin composition was put on the circuit board, and then an upper metal mold was laminated. After allowing the mold to cure the composition at 175°C, the mold and pellets were removed. Afterwards, batteries and buttons are injected to manufactur...
Embodiment 2)
[0080] In the above-mentioned Example 1, a portable electronic communication device was produced by carrying out the same method except that a composite resin composition having the following configuration was used instead of the composite resin composition. Composite resin composition, including: 40% by weight of YD-128 (Guodu Chemical Industry) as a bisphenol A series epoxy resin; 7% by weight of phenolic resin (Guodu Chemical Industry) as a phenolic curing agent; 2% by weight as BYK9076 (BYK Chemie Corporation) impregnated with an improving agent; 50% by weight of carbon fiber; and 1% by weight of additives.
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