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Silicone wafer degumming pre-washing device

A silicon wafer degumming and pre-rinsing technology, applied in the direction of cleaning methods using liquids, cleaning methods and utensils, cleaning methods using tools, etc., can solve problems such as chipping of silicon chips, reduce energy consumption, and reduce the rate of edge chipping , Reduce the effect of glue cold and heat shrinkage

Inactive Publication Date: 2014-01-15
无锡荣能半导体材料有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a silicon wafer degumming pre-flushing device, which can effectively solve the problem of silicon wafer chipping

Method used

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  • Silicone wafer degumming pre-washing device

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Embodiment Construction

[0012] The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention.

[0013] Such as figure 1 As shown, the two sides of the upper end of the plate heat exchanger 3 are respectively provided with a first inlet 2 and a second inlet 4, the first inlet 2 is connected to the outlet 7 of the cooling water 1 of the ingot furnace, and the second inlet 4 is a cold water injection port. The lower end of the heat exchanger 3 is provided with an outlet 5 of the plate heat exchanger, which is connected with the silicon wafer pre-flush pipeline 8 , and the pre-flush port 6 is arranged at the other end of the silicon wafer pre-flush pipeline 8 .

[0014] When in use, the heat generated during the heating process of the ingot furnace is passed through the cooling water, and the cooling water of the ingot furnace (at a temperature of 30°C) is transferred to the plate heat exchanger through the first inlet 2, and at the sa...

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Abstract

The invention provides a silicone wafer degumming pre-washing device. The silicone wafer degumming pre-washing device comprises a plate heat exchanger (3), wherein a first inlet (2) and a second inlet (4) are formed in the two sides of the upper end of the plate heat exchanger (3) respectively, the first inlet (2) is connected with an outlet (7) of ingot furnace cooling water, the second inlet (4) is a cold water injection port, a plate heat exchanger outlet (5) is formed in the lower end of the plate heat exchanger (3) and connected with a silicone wafer pre-washing pipeline (8), and a pre-washing port (6) is formed in the other end of the silicone wafer pre-washing pipeline (8). By means of the silicone wafer degumming pre-washing device, the inlet water temperature for silicone wafer pre-washing can be kept at 20-25 DEG C to adapt to the temperature after a silicone wafer is cut, the problem that glue contracts due to the temperature is relieved, the qualification rate is improved, and edge breakage rate is lowered. Meanwhile, energy consumption of a cooling water machine is reduced, and therefore the energy consumed in cooling with cooling water of ingots and single crystal is lowered.

Description

technical field [0001] The invention belongs to the field of solar photovoltaic preparation, and in particular relates to a silicon chip degumming pre-flushing device. Background technique [0002] Edge chipping is one of the major abnormalities in the slicing process and degumming process of polycrystalline silicon wafers, and it is highly variable. [0003] When the polycrystalline silicon rod is cut, the silicon rod on one side needs to be bonded to the glass, and the glue used is basically AB glue. This glue expands differently at different temperatures. [0004] There is a large difference in temperature between summer and winter, and the temperature of polysilicon wafers after cutting is generally 25-30 degrees. In summer, the pre-washing water temperature is generally around 18-23 degrees, and in winter it is generally only 5-9 degrees, which leads to different expansion coefficients of the glue, resulting in a higher number of edge collapse in winter than in summer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B1/00
CPCB08B3/02
Inventor 刘耀峰潘振东
Owner 无锡荣能半导体材料有限公司
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