9results about How to "Reduce chipping rate" patented technology

This invention discloses a high-density, high-thermal-conductivity hot-pressed aluminum nitride substrate and its preparation method, belonging to the field of ceramic thermally conductive materials technology. The aluminum nitride substrate is composed of aluminum nitride powder and a composite sintering aid, the composite sintering aid being a fluoride, with a total addition amount of 2%-8% of the aluminum nitride powder mass. The aluminum nitride substrate has a multi-layer composite structure, including an upper dense layer, a middle stress buffer layer, and a lower dense layer. The porosity of the upper and lower dense layers is ≤0.3%, and the porosity of the middle stress buffer layer is 1%-5%. The preparation method includes steps such as raw material mixing, multi-layer molding, hot-pressing sintering, and diamond wire saw cutting. This invention achieves grain boundary purification through a pure fluoride composite aid system, combined with a multi-layer structure design to absorb cutting stress and thermal stress, resulting in a substrate density ≥99.5%, thermal conductivity ≥240W / (mK), and an ultra-thin substrate edge chipping rate ≤3%, while simultaneously reducing the sintering temperature and shortening the production cycle.

The invention provides a method for improving edge breakage in a silicon wafer cutting process, the method is suitable for cutting a silicon wafer by using a cutting line, and in a cutter retracting stage, the linear speed of the cutting line is reduced and then constant speed is kept. According to the method, under the condition that the original cutting process is not changed, the cutting edge breakage proportion can be greatly reduced by controlling the cutting conditions.

The invention provides a chip packaging method, which comprises a chip positioning step and a chip routing step, and the chip positioning step comprises the following steps: providing a positioning platform provided with a flange structure; assembling a plurality of chips on the elastic part of the carrier plate; the carrier plate drives the chip to move towards the flange structure, when one side of the chip is in contact with the flange structure, the flange structure provides limiting, and the elastic part provides elastic buffering towards the flange structure for the chip so as to reduce the chip edge breakage probability and make up for the chip mounting position error at the same time. Therefore, the routing process error of a plurality of chips subjected to routing through the flange side of the flange structure is reduced, the routing error among all chips produced in a large scale is reduced to the minimum, and the consistency of chip routing is improved.

The present invention discloses a grinding wheel bar for glass processing and a CNC processing method, which comprises a rod handle, a rod head installed at one end of the rod handle, the rod head comprises a punching section, a finishing section and a roughing section arranged in sequence along the axial direction, the roughing section is connected to the rod handle, the diameter of the punching section is smaller than the finishing section, a plurality of annular grooves are arranged on the outer peripheral wall of the roughing section, all the annular grooves are arranged at intervals along the axial direction, and the width of the notch position of the annular groove is greater than the width of the groove bottom position, the groove bottom and the notch of the annular groove are connected by a conical surface, the angle θ between the generatrix of the conical surface and the axis where the roughing section of the rod head is located is 45° to 60°, and the glass is processed by using the above-mentioned grinding wheel bar. The present invention reduces the edge collapse rate of the glass cover plate, increases the processing speed, and improves the durability of the grinding wheel bar, thereby greatly saving costs.

The application discloses a carbon material cutting positioning table, a cutting equipment and a cutting process, and belongs to the technical field of carbon processing. The carbon material cutting equipment includes a carbon material cutting positioning table, a self-protection cutting mechanism and a vibration suppression protection mechanism. The application realizes coupling enhancement of positioning stability and vibration suppression efficiency in the cutting and processing of special-shaped carbon materials through deep cooperation of the material self-adaptive positioning mechanism, the special-shaped positioning assembly, the self-protection cutting mechanism and the vibration suppression protection mechanism. The overall technical effect of single mechanism independent operation is significantly better. The cutting edge collapse rate of the special-shaped carbon material is significantly reduced, the section quality is greatly improved, and automatic, self-adaptive and efficient precision cutting is realized.

The invention relates to an atomization chip, an atomizer and an electronic atomization device, and the atomization chip comprises a piezoelectric substrate, a first electrode and a second electrode. The piezoelectric substrate is provided with a first surface and a second surface which are opposite to each other, the first surface is provided with a first area and a second area surrounding the first area, and the second surface is provided with a third area and a fourth area surrounding the third area. The first electrode is arranged in the first area. The first electrode is arranged in the first area, the second electrode is arranged in the third area, a certain gap exists between the edge of the first electrode and the edge of the piezoelectric substrate and between the edge of the second electrode and the edge of the piezoelectric substrate, and when the atomization chip works, the gap cannot conduct electricity, so that the edge breakage rate of the atomization chip can be reduced, and the service life of the electronic atomization device can be prolonged.

The anti-static wafer comprises a plurality of chips, each chip in the plurality of chips comprises a plurality of pins, scribing channels, an anti-static lead, the scribing channels are located between two adjacent chips in the plurality of chips, the anti-static lead is configured to be connected with two or more pins in the plurality of pins, and the scribing channels are arranged between the scribing channels and the anti-static lead. At least one part of the anti-static lead is located outside the scribing channel in the extending direction of the scribing channel. According to the anti-static wafer, the yield of chips can be improved in the manufacturing process of the chips.

The present invention belongs to the technical field of solar silicon wafer separation, and in particular relates to a mechanism for preventing edge collapse during silicon wafer transmission, comprising a transmission motor, a rotating shaft, a transmission motor driving wheel, a silicon wafer water absorption plate, a transmission motor driven wheel, a supporting wheel, a transmission belt, a left-side spray nozzle, a right-side spray nozzle, a water spray pump, a water absorption pipe inlet, a water absorption pump, a controller, an in-position sensor and a bubbling mechanism. The present invention provides a mechanism for preventing edge collapse during silicon wafer transmission, which can make two silicon wafers separated in the air without contact when being disengaged during transmission, reduce the edge collapse rate caused by the silicon wafer transmission process, and can also improve the silicon wafer yield rate and silicon wafer separation effect.

The present invention relates to the field of photovoltaic single crystal silicon wafer processing, and in particular to a fast curing adhesive for solar silicon wafer cutting and a preparation method thereof. The fast curing adhesive for solar silicon wafer cutting provided by the present invention comprises component A and component B, wherein the component A comprises modified bisphenol A epoxy resin, glycidyl ester epoxy resin, modified powder filler, defoamer, anti-settling agent, colorant and coupling agent; the component B comprises polythiol, curing accelerator, defoamer, anti-settling agent, modified powder filler and thermoplastic toughening diluent; the modified bisphenol A epoxy resin is prepared by modifying bisphenol A epoxy resin with nanomaterials; the nanomaterial is prepared by modifying cellulose nanocrystals with tannic acid and methacrylic chloride. The adhesive prepared by the present invention has the advantages of high hardness, strong adhesion, high bonding shear strength, high bending strength, etc., excellent mechanical properties, short surface drying time and high curing efficiency. The adhesive prepared by the present invention can improve production efficiency and reduce the rate of wire stripping, edge collapse and rod drop while achieving stable cutting.