Epoxy resin composite material and preparation method thereof

An epoxy resin and composite material technology, applied in the chemical field, can solve the problems of limited application scope of epoxy resin, poor heat resistance, high crosslinking density, etc., achieve good economic benefits and market prospects, reduce edge collapse rate, improve Yield effect

Inactive Publication Date: 2021-07-06
无锡协芯半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resin has high cross-linking density after curing, and has shortcomings such as brittleness, poor heat resistance, and weak fatigue resistance, which limit the application range of epoxy resin.
At present, the performance of epoxy resin can no longer meet

Method used

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  • Epoxy resin composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] The preparation method of the epoxy resin composite material as described above includes the following steps:

[0026] (1) Polyamide-based rubber elastomer powder and epoxy resin, which are called corresponding weight, first, first mixing the two;

[0027] (2) Then, the corresponding weight of the polysulfide curing agent was added, stirred thoroughly, and the stirring time was about 2 min.

[0028] The epoxy resin composite provided by the present invention significantly reduces the collapse ratio of the silicon wafer during the production of silicon wafers, which significantly improves the yield of silicon production, and has good economic and market prospects.

Example Embodiment

[0029] Example 1

[0030] 100 g of an epoxy resin, 10 g of polyamide-based rubber elastomer powder, 100 g of polysulfide curing agent.

[0031] The 100 g of epoxy resin was mixed with 10 g of polyamide rubber elastomer powder; then 100 g of polysulfide curing agent, stirred again, stirred for about 2 min; fast and uniformly coated on the surface clean, dry, rough glass At the end, the operation time must be less than 10 min; the silicon bonding, block and curing process are performed, and the curing time must be greater than 6h, and it is ready.

Example Embodiment

[0032] Example 2

[0033] 100 g of epoxy resin, 30 g of polyamide rubber elastomer powder, 100 g of polysulfide curing agent.

[0034] The 100 g of epoxy resin is mixed with 30 g of polyamide rubber elastomer powder; then 100 g of polysulfide curing agent is added, stirred again, stirring time is about 2 min; fast and uniformly coated on surface clean, dry, rough glass At the end, the operation time must be less than 10 min; the silicon bonding, block and curing process are performed, and the curing time must be greater than 6h, and it is ready.

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Abstract

The invention provides an epoxy resin composite material which comprises epoxy resin and a powder material, the mass ratio of the epoxy resin to the powder material is 10: 1-2: 1, and the average particle size of the powder material is 1-15 microns; the epoxy resin is one or more of bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin or bisphenol F type epoxy resin; the powder material is polyamide rubber elastomer powder; the epoxy resin composite material further comprises a curing agent, and the curing agent is polymercaptan. According to the epoxy resin composite material, the edge breakage rate, the crack rate and the notch rate of the silicon wafer in the silicon wafer production process can be remarkably reduced, the yield of silicon wafer production can be remarkably improved, and good economic benefits and market prospects are achieved.

Description

technical field [0001] The invention relates to the field of chemistry, in particular to an epoxy resin composite material and a preparation method thereof. Background technique [0002] Epoxy resins generally refer to organic compounds containing two or more epoxy groups in their molecules. Except for a few, their relative molecular weights are not high. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents to form insoluble polymers with a three-way network structure. All polymer compounds containing epoxy groups in their molecular structure are collectively referred to as epoxy resins. The cured epoxy resin has good physical and chemical properties, it has excellent bonding strength to the sur...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L77/00C08G59/66C09J163/02C09J177/00C09J11/08H01L21/02
CPCC08L63/00C08G59/66C09J163/00C09J11/08H01L21/02002C08L77/00
Inventor 马国庆孟涛叶洪英
Owner 无锡协芯半导体科技有限公司
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