Mechanism for preventing edge breakage during solar silicon wafer fragmentation

Abstract

The invention belongs to the technical field of solar silicon wafer fragmentation, and particularly relates to a mechanism for preventing edge breakage during solar silicon wafer fragmentation, whichcomprises a transplanting manipulator, a conveying belt, a downward pressing in-place sensor, an upper computer, a downward pressing spray head, a downward pressing spray head water inlet pipe and a water pump, wherein the conveying belt is placed right below the transplanting manipulator; the downward pressing in-place sensor is installed on the right side of the transplanting manipulator and electrically connected with an upper computer; the downward pressing spray head is installed on the left side of the transplanting manipulator and connected with a water outlet of a water pump through adownward pressing spray head water inlet pipe, and the water pump is electrically connected with the upper computer. The invention provides a mechanism for preventing edge breakage during solar silicon wafer fragmentation, which can reduce the edge breakage rate in the wafer fragmentation process and can also improve the yield of the silicon wafers and the separation effect of the silicon wafers.

Description

technical field [0001] The invention belongs to the technical field of solar silicon wafer slicing, and in particular relates to a mechanism for preventing chipping of solar silicon wafers during slicing. Background technique [0002] At present, in the field of solar photovoltaic or semiconductor, it is necessary to cut the rod-shaped raw material into sheet-shaped raw materials with a certain thickness, and then put the sheet-shaped raw materials into the silicon wafer holder and separate the silicon wafers one by one through a specific water spray nozzle under water. However, in the existing equipment, in the process of separating the silicon wafers one by one under water by the water spray nozzle, because the spray water flow is relatively not very stable, it will cause shaking between the separated silicon wafers, thus As a result, when the separated silicon wafers are transported to the next-level mechanism, the tail end of the previous piece and the front end of the n...

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to solve the problem of chipping of solar silicon wafers in the process of slicing in the prior art, and to provide a mechanism for preventing chipping of solar silicon chips during slicing, which can reduce the risk of chipping. The edge chipping rate in the process can also improve the yield of silicon wafers and the separation effect of silicon wafers

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