Wafer taking method for semiconductor silicon wafer polishing

Abstract

The invention relates to a wafer taking method for semiconductor silicon wafer polishing. According to the method, a latex sucker with a hole in the center and an airbag at the rear end is used for taking a silicon wafer; during wafer taking, a user can exhaust part of air inside the airbag, then align the central hole of the latex sucker to the half-radius part of the silicon wafer and then release the airbag, accordingly, the silicon wafer is sucked onto the latex sucker; after the silicon wafer is taken out, the user can exhaust air inside the airbag by hand, and then the silicon wafer can automatically drop down from the latex sucker. By means of the wafer taking method for the semiconductor silicon wafer polishing, scratches on the surface of the silicon wafer and the edge breakage rate of a non-chamfering silicon wafer can be reduced, and the reject ratio of the silicon wafer is reduced from original 2% to 0.5%.

Description

technical field [0001] The invention relates to a method for taking out semiconductor polished silicon wafers. Background technique [0002] At present, in the silicon wafer grinding process, after the silicon wafer is ground, the silicon wafer is adsorbed on the grinding disc, and the silicon wafer needs to be taken out from the grinding disc. Take out the silicon wafer carrier planetary plate, and then touch the silicon wafer to the edge of the grinding disc with your hands, so that part of the silicon wafer is out of contact with the grinding disc, and grab the silicon wafer directly from the disengaged position by hand. The advantage of this process is that the removal speed is fast , but it is easy to cause scratches on the surface of the silicon wafer and edge chipping caused by the collision of the silicon wafer; the other is to use a small shovel to scoop the silicon wafer directly from the carrier planetary plate. This process is not easy to use and requires skille...

AI Technical Summary

Problems solved by technology

[0002] At present, in the silicon wafer grinding process, after the silicon wafer is ground, the silicon wafer is adsorbed on the grinding disc, and the silicon wafer needs to be taken out from the grinding disc. Take out the silicon wafer carrier planetary plate, and then touch the silicon wafer to the edge of the grinding disc with your hands, so that part of the silicon wafer is out of contact with the grinding disc, and grab the silicon wafer directly from the disengaged position by hand. The advantage of this process is that the removal speed is fast , but it is easy to cause scratches on the surface of the silicon wafer and edge chipping caused by the collision of the silicon wafer; the other is to use a small shovel to scoop the silicon wafer directly from the carrier planetary plate. This process is not easy to use and requires skilled operators. If Improper operation can easily cause edge chipping of silicon wafers