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Module support, electrical box of air conditioner outdoor unit and air conditioner outdoor unit

An electrical box and circuit board technology, applied in the field of parts of air conditioners, can solve the problems of inability to meet the reliability and comfort of air conditioners, increase the cost of radiators, and limited space, so as to reduce the temperature, solve the problem of heat dissipation, The effect of increasing efficiency

Active Publication Date: 2017-02-08
GREE ELECTRIC APPLIANCES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to the current cooling method that only uses radiators, the radiator needs to be designed very large, and the existing air conditioner outdoor unit has limited space, which cannot meet the reliability and comfort of the air conditioner, and increases the cost of the radiator

Method used

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  • Module support, electrical box of air conditioner outdoor unit and air conditioner outdoor unit
  • Module support, electrical box of air conditioner outdoor unit and air conditioner outdoor unit
  • Module support, electrical box of air conditioner outdoor unit and air conditioner outdoor unit

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Embodiment Construction

[0028] The present invention will be described in detail below with reference to the accompanying drawings and examples. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0029] In one embodiment of the present invention, a module support 120 is provided, and the module support 120 has a front side 120a and a back side 120b. For ease of description, the air inlet direction of the module support 120 is defined as the first direction (that is, figure 1 the width direction of the middle module support 120).

[0030] Such as figure 1 As shown, a plurality of chip mounting surfaces 121 are provided on the front surface 120a of the module holder 120, and each chip mounting surface 121 has first through holes 122a, 122b, 122c, 122d through which the chip pins pass. In one of the embodiments, the chip mounting surface 121 includes a first mounting surface 121a, a second mounting surface ...

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PUM

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Abstract

The invention discloses a module support. The module support has a front face and a back face, the front face of the module support is provided with one or more chip assembling faces, each chip assembling face is provided with a first through hole for a chip pin to penetrate through, and the back face of the module support is provided with a connection portion used for being connected with a circuit board. The back face of the module support is further provided with an annular flange surrounding the first through holes, and the flange surrounding the first through holes is provided with at least one first air inlet notch and at least one first air outlet notch. By means of an air guide structure formed by the flange, the air inlet notch and the air outlet notch, air can be guided to a chip needing radiating, the contact area of the chip and air is increased, radiating efficiency is improved, on the premise that cost is not increased, the work temperature of a main board can be further reduced, the size of a radiator body is reduced, and cost is reduced. Meanwhile, the invention further discloses an electric appliance box of an air conditioner outdoor unit with the module support and the air conditioner outdoor unit.

Description

technical field [0001] The invention relates to components of an air conditioner, in particular to a module bracket, an electrical box of an outdoor unit of an air conditioner with the module bracket, and an outdoor unit of an air conditioner with the electrical box. Background technique [0002] The electrical box of the outdoor unit of the air conditioner is the main structure to ensure the normal and reliable operation of the motherboard. A key factor affecting the reliability of the motherboard is temperature. Therefore, heat dissipation has become a bottleneck for electronic components. [0003] At present, the current electrical boxes usually use heat sinks to reduce the temperature of electronic components, that is, a heat sink with a shaped aluminum sheet is installed under the area of ​​the motherboard where the heat is large (mainly at the module bracket), and the fan rotates with the help of a fan. Take away the heat generated by the electronic components of the m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F24F1/24F24F1/22
Inventor 张辉陈绍林杨检群罗镇雄吴俊鸿刘炜
Owner GREE ELECTRIC APPLIANCES INC