Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate processing equipment

A substrate processing device and technology for substrates, which are applied in the directions of cleaning methods using liquids, cleaning methods and utensils, chemical instruments and methods, etc., can solve problems such as larger space and reduced processing capacity, and achieve improved processing capacity and small height and size. , the effect of good processing ability

Active Publication Date: 2016-04-27
DAINIPPON SCREEN MTG CO LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, in recent years when the size of the substrate has been increasing, the space required to invert the substrate has increased, and the size of the inversion unit has also increased accordingly.
Therefore, for example, when a required number of delivery units and inversion units are stacked on the transfer unit, as the height dimension of the inversion unit increases, the vertical movement distance (stroke) of the hand of the transfer robot will increase. ) increases, these directly lead to a reduction in processing capacity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate processing equipment
  • Substrate processing equipment
  • Substrate processing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0054] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following embodiments are examples of actualizing the present invention, and the embodiments do not limit the technical scope of the present invention.

[0055] In addition, in the following description, the "surface" of a substrate means the surface on which a pattern (for example, a circuit pattern) is formed on the principal surface of the substrate, and the "rear surface" means the surface opposite to the surface. In addition, the "upper surface" of the substrate refers to the surface facing the upper side among the main surfaces of the substrate, and the "lower surface" refers to the surface facing the lower side (regardless of whether the front surface or the back surface is).

[0056]

[0057] refer to figure 1 , figure 2 , the configuration of the substrate processing apparatus 1 according to the embodiment will be described. figure 1 It is a plan view o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a technology that can improve the processing capacity of the substrate processing device.The substrate processing device (1) has the transfer unit (30) that is configured in the connection part between the cleaning processing area (20) and the divisioner area (10).The transfer unit (30) has: flip support department (701), which supports the substrate (W) in a horizontal posture; the conveying support department (601A), which is separated from the upper and lower direction of the support department (701) to the partitioned partition configuration configuration, And support the substrate (W) in a horizontal posture; hold the flip agency (80), which makes the support support on the substrate (W) on the supporting department (701), and the flip substrate (W) is supported again.Flip the support department (701).Here, a part of the substrate (W) supporting the supporting support department (601A) is configured in the flip region M of the substrate (W) flip region of the substrate (80) of the clamping mechanism (80).

Description

technical field [0001] The present invention relates to a technique for processing a plurality of substrates, such as semiconductor substrates, glass substrates for liquid crystal display devices, glass substrates for plasma displays, glass substrates for photomasks, substrates for optical discs, etc. (hereinafter, simply referred to as "substrates") "). Background technique [0002] There are various substrate processing apparatuses for processing substrates. For example, in the substrate processing device of Patent Document 1: the substrate transfer section is used to connect the indexer area and the cleaning processing area, wherein the indexer area is used to collect unprocessed substrates and processed substrates, and the cleaning processing area is used to clean the substrates. . The transfer manipulators dedicated to each unit are respectively arranged on the indexer area and the cleaning treatment area. [0003] In such a substrate processing apparatus, in conside...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304
CPCB08B3/04H01L21/67051H01L21/6719H01L21/67769H01L21/67781H01L21/68H01L21/68707H01L21/67046H01L21/67207H01L21/67706H01L21/67718
Inventor 加藤洋
Owner DAINIPPON SCREEN MTG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com