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Photosensor chip package structure

A technology of chip packaging structure and optical sensing chip, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems that the packaging area cannot be reduced, the packaging structure is complicated, etc., and the complex packaging structure and manufacturing process can be simplified. , reduce optical signal interference, and reduce the package area

Active Publication Date: 2014-01-15
TXC CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thick light-blocking material and the distance between the sensor and the IR LED make the packaging area unable to be reduced, and the existence of the light-blocking material also makes the packaging structure more complicated

Method used

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  • Photosensor chip package structure
  • Photosensor chip package structure
  • Photosensor chip package structure

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Embodiment Construction

[0021] Please refer to FIG. 2(a), FIG. 2(b), FIG. 2(c) and FIG. 2(d) together, which are respectively a perspective view, a cross-sectional view, a top view, and a bottom view of the light-sensing chip package structure of the present invention. As shown in the figure, the light-sensing chip package structure 20 of the present invention mainly includes a substrate 22; a light-emitting chip 24; and an optical sensor chip 26.

[0022] The substrate 22 includes a first groove 222, a second groove 224 and a light guiding groove 226. The substrate 22 has opacity. The opening end directions of the first groove 222 and the second groove 224 are different, and the first groove 222 and the second groove 224 are at least partially overlapped. One open end of the light guiding groove 226 is on the same side as the open end of the first groove 222, and the other open end is connected to the second groove 224.

[0023] The light emitting chip 24 is disposed in the first groove 222, and the li...

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Abstract

A photosensor chip package structure comprises a substrate, a light-emitting chip and a photosensor chip including an ambient light sensing unit and a proximity sensing unit. The substrate has a first basin, a second basin and a light-guiding channel. The openings of the first and second basins respectively face different directions. One opening of the light-guiding channel and the opening of the first basin face the same direction. The other opening of the light-guiding channel interconnects with the second basin. The light-emitting chip is arranged in the first basin. The photosensor chip is arranged in the second basin. The light-guiding channel conducts the light generated by the light-emitting chip and the ambient light to the photosensor chip, so as to make the photosensor chip act.

Description

Technical field [0001] The invention relates to a light-sensing chip packaging structure, in particular to a light-sensing chip packaging structure having an ambient light sensing unit and a proximity sensing unit. Background technique [0002] Consumer electronic products, such as mobile phones, use more and more sensors to save energy and enhance the interaction between humans and machines. For example, the latest mobile phones currently use more than ten types of sensors. Therefore, engineers are all looking for ways to integrate sensors in order to reduce energy, space and costs. [0003] The ambient light sensor is used to sense changes in ambient light sources and change the brightness of the mobile phone panel. When the surrounding brightness is dim, the panel brightness will be dimmed to avoid eye irritation. When the outdoor light source is strong, the backlight of the mobile phone panel will be brighter and increase the visibility. The ambient light sensor changes the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/31
CPCH01L31/0203H01L31/173H01L2224/48091H01L2224/48465H01L2924/00014H01L2924/00H01L23/31
Inventor 彭英铭
Owner TXC CORP
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