Chip bonding glass pick-up device based on chip bonding process

A chip bonding glass and chip technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as increasing the workload of debugging and affecting work efficiency, so as to improve the time of debugging and improve production efficiency effect

Active Publication Date: 2017-04-05
SHENZHEN XINSANLI AUTOMATION EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing chip-attached glass movement is to pick up the glass through the vacuum nozzle and then move it. For different specifications of glass, it is usually necessary to replace the suction device suitable for the size of the glass, which increases the workload of debugging and affects the work efficiency

Method used

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  • Chip bonding glass pick-up device based on chip bonding process
  • Chip bonding glass pick-up device based on chip bonding process
  • Chip bonding glass pick-up device based on chip bonding process

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Embodiment Construction

[0014] In order to make the purpose, technical solutions and advantages of the invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the invention Examples, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] Such as figure 1 , figure 2 with image 3 As shown, the present invention provides an embodiment of a chip bonding glass pick-up device based on a chip bonding process.

[0016] The chip bonding glass pick-up device includes: two suction nozzle brackets 2 arranged in parallel and a fixed rod 1 fixed to the suction nozzle brackets 2, and at least one movable vacuum is pr...

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Abstract

The invention is applicable to the technical field of package applicable to a chip on glass manufacture procedure. The invention provides a pickup device for a chip on glass based on a chip bonding manufacture procedure. The pickup device comprises two suction nozzle brackets arranged in parallel and fixed rods fixedly connected with the suction nozzle brackets, wherein at least one movable vacuum suction nozzle is arranged at each one of the two ends of each suction nozzle bracket; and the vacuum suction nozzles are connected with a vacuum mechanism. In the working process, with regard to glass with different specifications, the position of each vacuum suction nozzle can be adaptively adjusted to be matched with the size of the glass. Compared with the prior art, the increased workload and debugging time in the process of replacing the pickup device when the glass with the different specifications is sucked can be avoided; and the time for debugging the pick-up device to be adapted to the glass with the different specifications is reduced so as to improve the production efficiency.

Description

technical field [0001] The invention relates to the technical field of packaging for chip on glass (Chip On Glass; COG) process, in particular to a pick-up device for picking up and moving chips on glass. Background technique [0002] In the traditional COG process, it is necessary to move the chip bonding glass to the chip bonding position to facilitate the operation and processing of the subsequent process. The existing chip-attached glass movement is to pick up the glass through the vacuum nozzle and then move it. For different specifications of glass, it is usually necessary to replace the suction device suitable for the size of the glass, which increases the workload of debugging and affects the work efficiency. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a chip bonding glass pick-up device based on the chip bonding process, which can avoid the increased work of replacing the pick-up device when pickin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
CPCH01L21/6838H01L2221/68363
Inventor 李先胜
Owner SHENZHEN XINSANLI AUTOMATION EQUIP
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