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A kind of pin connection pin press-in welding method of pcb board

A technology of PCB board and welding method, applied in the field of PIN connection pin press-in welding, can solve problems such as hidden quality problems, PCB crushing, external stress loosening and virtual welding, etc., and achieve the effect of improving installation space

Active Publication Date: 2016-04-20
SHENZHEN HUICHEN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because there is a pressure effect when pressing the PIN connection pin, it is easy to crush the PCB, or when the PCB is deformed, the soldered components (such as resistors, SMD LEDs) are loosened and soldered due to external stress, causing quality problems. The minimum width of the pressure head of the PIN machine with pressure is 5mm, resulting in the minimum distance between the PIN connection pin and other electronic components on the PCB board not less than 4mm, and there are many bottlenecks in the implementation

Method used

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Embodiment Construction

[0010] The present invention will be described in detail below.

[0011] This embodiment provides a method for press-welding the PIN connection pins of a PCB board. The manufacturing method is used to press the PIN connection pins into and weld them on the PCB board. With this method, the corresponding electronic components do not need to be welded. Due to the risk of stress damage, the minimum distance between the PIN connection pin and the electronic components can reach 1mm, which greatly improves the installation space of the components.

[0012] First, make PIN holes on the bare PCB, that is, make PIN holes on the bare PCB without soldering any electronic components, and then press the PIN connection pins into the PIN holes, and each PIN connection pin corresponds to Press into one of the PIN holes, and make the exposed PIN cap no more than 0.2mm, for example, the exposed PIN cap can be 0.2mm, or 0.15mm, etc., preferably the exposed PIN cap It is 0.2mm to ensure the melt...

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Abstract

The invention discloses a PIN connection pin pressed welding method for a PCB (Printed Circuit Board) board, which comprises the following steps of: A, forming a PIN hole on a PCB bare board; B, correspondingly pressing a PIN connection pin into the PIN hole and enabling the length of an exposed part of the PIN pin cap to be not over 0.2mm; C, forming a mesh opening 0.2mm to 0.8mm away from the PIN pin cap in the PCB bare board; D, installing an electronic component on the PCB bare board to form a PCB board semi-finished product; E, carrying out reflow soldering on the PCB board semi-finished product and welding the PIN pin cap and the PCB together. According to the invention, after the pressure generated when the PIN connection pin is pressed into the PCB board is released by the formed mesh opening, the electronic component is installed, and thus, the pressure is timely released and the installed electronic component has no stress damage risk; the minimum spacing between the PIN connection pin and the electronic component can reach 1mm, so that the installation space of the electronic component is greatly promoted.

Description

technical field [0001] The invention relates to a PCB board, in particular to a press-fit welding method for a PIN connection pin of a PCB board. Background technique [0002] In the processing of PCB semi-finished products, the connection ends of some products are PIN connection pins, which need to be pressed into the PIN holes on the PCB to fix them, and then soldered to fix them. Because there is a pressure effect when pressing the PIN connection pin, it is easy to crush the PCB, or when the PCB is deformed, the soldered components (such as resistors, SMD LEDs) are loosened and soldered due to external stress, causing quality problems. The minimum width of the indenter of the press PIN machine is 5mm, resulting in the minimum distance between the PIN connection pin and other electronic components on the PCB board not less than 4mm, and there are many bottlenecks in the implementation of the operation. [0003] Therefore, there are defects in the prior art and need to be ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
Inventor 冯洋欧阳小银
Owner SHENZHEN HUICHEN ELECTRONICS
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