Self-adaptive magnetic field adjustment type magnetic-controlled sputter coating device and coating method thereof

A magnetron sputtering coating and magnetic field adjustment technology, which is applied in sputtering coating, ion implantation coating, vacuum evaporation coating, etc., can solve the problem of low utilization rate of planar targets and poor production continuity of magnetron sputtering coating equipment and other issues, to achieve the effect of convenient implementation, increase in quantity, and enhancement of area

Active Publication Date: 2014-02-05
SUZHOU JUZHEN PHOTOELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] For this reason, what the present invention is to solve is the technical problem of poor production continuity and low utilization rate of planar targets in the existing technology of magnetron sputtering coating equipment, and provides a real-time detection of magnetic field and adjustment, high production efficiency, planar target Adaptive magnetic field adjustment type magnetron sputtering coating equipment and coating method with high target utilization

Method used

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  • Self-adaptive magnetic field adjustment type magnetic-controlled sputter coating device and coating method thereof
  • Self-adaptive magnetic field adjustment type magnetic-controlled sputter coating device and coating method thereof
  • Self-adaptive magnetic field adjustment type magnetic-controlled sputter coating device and coating method thereof

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Embodiment 1

[0050] This embodiment provides an adaptive magnetic field adjustment type magnetron sputtering coating equipment, such as Figure 2a and Figure 2b As shown, it includes a substrate 1, a target 2 and a yoke 4 arranged in parallel and in sequence, and three permanent magnets 3 that are close to the target 2 and directly arranged on the yoke 4, and the magnetic poles of the adjacent permanent magnets 3 are in opposite directions. , the magnetic pole direction of the permanent magnet 3 is perpendicular to the target 2 .

[0051] The permanent magnets 3 are equidistantly arranged on the yoke 4 , and the centers of the substrate 1 , the target 2 and the yoke 4 are located on the same axis.

[0052] As other embodiments of the present invention, the number of the permanent magnets 3 may be an odd number greater than or equal to 3, all of which can achieve the purpose of the present invention and belong to the protection scope of the present invention.

[0053] An energized coil 6...

Embodiment 2

[0065] This embodiment provides an adaptive magnetic field adjustment type magnetron sputtering coating equipment, such as Figure 2a and Figure 2b As shown, it includes a substrate 1, a target 2 and a yoke 4 arranged in parallel and in sequence in the chamber, and three permanent magnets 3 that are close to the target 2 and directly arranged on the yoke 4, and the adjacent permanent magnets 3 The magnetic pole direction is opposite, and the magnetic pole direction of the permanent magnet 3 is perpendicular to the target material 2 .

[0066] The specification of the substrate 1 is 210mm×260mm, the specification of the target material 2 is 200mm×250mm×9mm, the specification of the yoke 4 is 25mm×200mm, and the specification of the permanent magnet 3 is 20mm×25mm× 70mm.

[0067] The distance between the substrate 1 and the target 2 is 68 mm, and the distance between the target 2 and the yoke 4 is 86 mm.

[0068]In this embodiment, there are three permanent magnets 3, and th...

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Abstract

The invention discloses a self-adaptive magnetic field adjustment type magnetic-controlled sputter coating device. An electrified coil is arranged between adjacent permanent magnets; a hall sensor is arranged between the electrified coil and a magnet yoke; a length direction of the electrified coil is vertical to directions of magnetic poles of the permanent magnets; a magnetic field strength detecting system is externally connected with the hall sensor and applied to real-time monitoring of the magnetic field strength; a circuit control module is externally connected with the electrified coil and electrically connected with the magnetic field strength detecting system; current flowing through the electrified coil is adjusted according to data of the magnetic field strength detecting system, so that magnetic field distribution is changed and the magnetic field is in a most optimized state all the time, namely, magnetic force lines and a target surface are located on the same plane to the greatest extent, so that the effect of a maximum utilization rate of target material is achieved; meanwhile, the magnetic field strength can be monitored in real time and adjusted without the need of interrupting the coating process, so that the production efficiency is high.

Description

technical field [0001] The invention relates to the field of magnetron sputtering coating, in particular to an adaptive magnetic field adjustment type magnetron sputtering coating equipment and a preparation method thereof. Background technique [0002] Magnetron sputtering coating technology has the advantages of high sputtering rate, high deposition rate, low deposition temperature, and good film quality. It is one of the most important technologies in the industrial production of coatings. [0003] The electrons collide with argon atoms in the process of accelerating to the substrate under the action of the electric field, and a large number of argon ions and electrons are ionized. Target atoms or molecules, neutral target atoms or molecules are deposited on the substrate to form a film. [0004] The target in magnetron sputtering coating equipment is usually made of high-purity noble metal or alloy, which is expensive. Whether the target can be used to the maximum becom...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/56
Inventor 马栋梁崔德国
Owner SUZHOU JUZHEN PHOTOELECTRIC
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