Laminated-substrate processing method and processing apparatus

A technology for bonding substrates and processing methods, applied in auxiliary devices, metal processing equipment, manufacturing tools, etc., can solve problems such as inconvenience, reduce the number of scans, and achieve the effect of processing time

Inactive Publication Date: 2014-02-12
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0016] This shows that above-mentioned existing technology obviously still has inconvenience and defect in structure and use, and urgently needs to be further improved

Method used

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  • Laminated-substrate processing method and processing apparatus
  • Laminated-substrate processing method and processing apparatus
  • Laminated-substrate processing method and processing apparatus

Examples

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Embodiment Construction

[0044] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation and structure of the processing method and processing device for the laminated substrate proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , features and their effects are described in detail below.

[0045] Hereinafter, the processing method of the bonded board|substrate of this invention is demonstrated using drawing. In this example, the processing of bonding glass substrates will be described.

[0046] figure 1 An example of a substrate processing apparatus for carrying out the processing method of the present invention is shown.

[0047] The substrate processing apparatus A is provided with a moving table 2 along a pair of guide rails 3, 4 arranged in parallel on the horizontal platform 1, figure 1 The back and f...

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Abstract

The invention refers to a substrate processing method and a processing apparatus which can meanwhile process an upper side substrate and a lower side substrate of a laminated-substrate. In the substrate processing method, a laminated-substrate W carried on a platform is irradiated to process lineation grooves, and the short pulse laser beam with pulse width smaller than 10-10 seconds emitted from a laser light source is divided into two beams; the two beams L1 and L2 respectively penetrate a focus in different angles of divergence to form two focuses P ' and S ' with different positions through a focus formation convex lens, allowing the focus S 'of one beam to reach the upper side substrate W1 of the laminated-substrate W, and the focus S 'of another beam to reach the lower side substrate W2 of the laminated-substrate W, and the upper side substrate W1 and the lower side substrate W2 are meanwhile be processed by means of the two laser beams.

Description

technical field [0001] The present invention relates to a processing method and processing device for laminating substrates of brittle materials such as glass and sapphire using laser beams. Background technique [0002] A processing method using a pulsed laser is known as a processing method for forming division starting points such as scribe grooves (cut grooves) on brittle material substrates such as glass substrates, silicon substrates, and sapphire substrates. The above-mentioned processing methods are common in that the substrate is heated by the energy irradiated with pulsed laser light, but the mechanisms for forming the origin of division are quite different and have different characteristics. [0003] For example, when cutting a glass substrate, laser scribing processing by "thermal strain" is used in order to form a scribe groove on a line to be cut (Patent Document 1). This laser scribing process is as follows: First, the laser beam is irradiated along the plann...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/046B23K26/60B23K26/70
CPCB23K26/0006B23K26/0643B23K26/0648B23K26/067B23K26/364B23K26/40B23K26/57B23K2103/00B23K2103/50B23K2103/56B23K26/0622B23K26/20B23K37/0461
Inventor 中谷郁祥
Owner MITSUBOSHI DIAMOND IND CO LTD
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