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Sapphire cutting device

A cutting device, sapphire technology, applied in the direction of welding/welding/cutting items, laser welding equipment, manufacturing tools, etc., can solve the problems of replacement of diamond-coated wire, high cutting cost, expensive diamond, etc.

Inactive Publication Date: 2014-02-12
SCIENBIZIP CONSULTINGSHENZHENCO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, sapphire is mainly cut by diamond coated wire. However, on the one hand, because diamond itself is relatively expensive, and on the other hand, due to contact cutting, the diamond coated wire needs to be replaced after it is worn to a certain extent, resulting in cutting costs. high
In addition, cutting sapphire by abrasion of the diamond-coated wire back and forth is less efficient

Method used

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Embodiment Construction

[0011] see Figure 1-2 , the sapphire cutting device 10 according to the preferred embodiment of the present invention includes an ultraviolet laser source 100 and a collimating lens 200 . The ultraviolet laser source 100 is used to emit a laser beam 110 . The collimating lens 200 is used to converge the laser beam 110 into a parallel laser beam 120 . The parallel laser beam 120 is used to cut the sapphire 20 . The working waveband of the ultraviolet laser source 100 is 200-400 nanometers.

[0012] In this way, the cost can be reduced by using the lower-cost ultraviolet laser source 100 and the collimator lens 200 instead of the higher-cost diamond. In addition, laser cutting can achieve high-speed cutting and improve efficiency.

[0013] The ultraviolet laser source 100 is an excimer laser source, or adopts a laser diode or a high-power light-emitting diode.

[0014] The preferred operating wavelength of the ultraviolet laser source 100 is 350-390 nm.

[0015] Specifica...

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Abstract

The invention provides a sapphire cutting device. The sapphire cutting device comprises an ultraviolet laser source and a collimating lens, wherein the ultraviolet laser source is used for sending out a laser beam; the collimating lens is used for converging the laser beam into a parallel laser beam; the parallel laser beam is used for cutting sapphire; the working wavelength range of the ultraviolet laser source is 200-400 nm. Thus, the cost can be reduced since the ultraviolet laser source and the collimating lens with lower cost are adopted for replacing diamond with higher cost. In addition, laser cutting can realize high-speed cutting, and the efficiency is improved.

Description

technical field [0001] The invention relates to sapphire cutting technology, in particular to a sapphire cutting device. Background technique [0002] At present, sapphire is mainly cut by diamond coated wire. However, on the one hand, because diamond itself is relatively expensive, and on the other hand, due to contact cutting, the diamond coated wire needs to be replaced after it is worn to a certain extent, resulting in cutting costs. high. Also, cutting sapphire with back and forth wear on a diamond-coated wire is less efficient. Contents of the invention [0003] In view of this, it is necessary to provide a sapphire cutting device that can reduce costs and improve efficiency. [0004] A sapphire cutting device includes an ultraviolet laser source and a collimating lens. The ultraviolet laser source is used to emit a laser beam. The collimating lens is used to converge the laser beam into a parallel laser beam. This parallel laser beam is used to cut sapphire. T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38
CPCB23K26/38B23K26/40B23K2103/50
Inventor 陈杰良
Owner SCIENBIZIP CONSULTINGSHENZHENCO
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