Electronic device and heat dissipation structure thereof

Abstract

The invention discloses an electronic device and its heat dissipation structure. The electronic device includes a circuit board and a heat dissipation structure. The circuit board contains an electronic component. The heat dissipation structure has a virtual structure plane. The heat dissipation structure includes a fin group, a connecting portion and a heat pipe. The fin group is arranged on the structural plane, and the fin group includes a plurality of cooling strips, and the cooling strips extend along a first direction. The heat dissipation strips are connected with each other by the connection part. At least a part of the connection part is connected with at least a part of the heat pipe, and the heat pipe and the connection part extend along a second direction. The fin group and the connecting part are integrally formed by a die-casting method, and the first direction and the second direction form an angle greater than 0. Using the hollow design of the fin group and the configuration of the heat pipe, the heat dissipation structure can quickly remove the heat energy of the electronic components, so as to improve the heat dissipation efficiency.

Description

technical field [0001] The invention relates to an electronic device and its heat dissipation structure, in particular to an electronic device with a plurality of heat dissipation strips and its heat dissipation structure. Background technique [0002] Compared with a general personal computer, a thin client refers to a low-level computer device that does not have a built-in CD drive, hard disk, floppy disk drive, and other unnecessary hardware and software devices or functions. The thin computer is connected to a server, and the applications and data of the thin computer are stored in the server. When the user uses the thin computer, the thin computer transmits the user's command to the server, and the server executes the calculation of the data required by the user and stores the data. Next, the server transmits the calculated result to the thin computer, and finally the calculated result is displayed on a display for viewing by the user. In other words, the thin compute...

AI Technical Summary

Problems solved by technology

[0005] In view of the problem of poor heat dissipation efficiency of the above-mentioned simplified computer, the object of the present invention is to provide an electronic device and its heat dissipation structure, so as to improve the heat dissipation efficiency of the simplified computer

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