Chuck mechanism for transferring semiconductor chips
A sucker mechanism and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as grain crushing, achieve the effects of reducing adsorption time, saving time, and improving product yield
Active Publication Date: 2016-07-06
SUZHOU GOODARK ELECTRONICS CO LTD
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Problems solved by technology
[0004] The purpose of the present invention is to provide a suction cup mechanism for transferring semiconductor chips, which improves the technical problem that the crystal grains are easily crushed when the semiconductor crystal grains are adsorbed in the manufacturing process, and greatly improves the adsorption rate, thereby improving the product quality. Yield, reduce resource consumption
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Embodiment
[0026] Embodiment: a sucker mechanism for transferring semiconductor chips, the graphite boat has a grain groove for placing semiconductor crystal grains, the sucker device includes: a handle 2 and a cover plate 3 with a first cavity 1 inside, the One end of the handle 2 is provided with an air nozzle 4 communicating with the first cavity 1, the lower surface of the handle 2 is provided with at least one first air hole 5 communicating with the first cavity 1, and the cover plate 3 A second vent hole 6 corresponding to the first vent hole 5 is provided, and a gas connecting pipe 7 communicates with the first vent hole 5 and the second vent hole 6; a bottom plate 8 is installed on the lower surface of the cover plate 3 , the bottom plate 8 and the cover plate 3 form a second cavity 10 communicating with the first cavity 1 through the side plate 9, and the bottom plate 8 is provided with several suction nozzles 11 for absorbing the semiconductor crystal grains and at least two le...
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The invention discloses an attracting disc mechanism for moving semiconductor chips. The attracting disc mechanism comprises a handle and a cover plate. A base plate is installed on the bottom surface of the cover plate. A movable through hole plug formed by a top plug body and a bottom plug body and leakage through holes are installed in clearance fit. The width of a top air-guiding rib is more than that of a bottom air-guiding rib. The diameters of a bottom end face portion and a top end face portion are more than those of the leakage through holes. The distance between the top end face portion and the bottom end face portion of the movable through hole plug is more than the thicknesses of the leakage through holes. Therefore, the movable through hole plug is guaranteed to move up and down along the leakage through holes. When the bottom plug body of the leakage through holes encloses the leakage through holes, air flow enters from nozzles. When the top plug body of the leakage through holes encloses the leakage through holes, the air flow enters from the leakage through holes. The attracting disc mechanism resolves a technical problem that crystalline grains are easy to damage when adsorbed in a semiconductor crystalline grain manufacturing process and greatly increases an adsorption rate so as to increase a product yield rate and decrease resource loss.
Description
technical field [0001] The invention relates to a tool for diode production, in particular to a sucker mechanism for transferring semiconductor chips. Background technique [0002] Existing semiconductor grains often involve a variety of production processes, which require semiconductor grain transfer. In the prior art, in the process of adsorption or transfer, the crystal grains often encounter the pre-welding boat and the assembly welding boat, which may damage the crystal grains and cause the final product to be defective; secondly, due to the flatness of the gas nozzle or the wear of the gas nozzle The reason is that the distance between the individual gas nozzle and the die is too large, so that the whole die cannot be completely sucked up. [0003] The prior art solves the above technical problems by adopting the technical solution of Chinese Patent Application No. 201110217430.5, which records that an air leakage device is installed on the original suction cup. The ...
Claims
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IPC IPC(8): H01L21/683
CPCH01L21/6838
Inventor 葛永明韦德富张洪海任志龙
Owner SUZHOU GOODARK ELECTRONICS CO LTD