Device and method for manufacturing carrier bands

A technology of carrier tape and transmission device, which is applied in the production of carrier tape and the packaging of electronic components. It can solve the problems of poor bonding between the upper surface of the carrier tape and the adhesive tape, rough upper surface, etc., and achieve uniform thickness, easy falling off, The effect of precise angle and size

Inactive Publication Date: 2014-03-26
SUZHOU CONPLAS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the carrier tape is processed, the concave bottom of the carrier tape is flat, but the upper surface is relatively rough, or when the molten plastic material used to make the carrier tape contains impurities, it will protrude upward because there is no force on the outer surface of the carrier tape. Poor adhesion between the upper surface of the carrier tape and the tape

Method used

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  • Device and method for manufacturing carrier bands
  • Device and method for manufacturing carrier bands
  • Device and method for manufacturing carrier bands

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Embodiment Construction

[0017] In order to facilitate the description of specific implementations of the present invention, the implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0018] figure 1 Show the structural representation that the present invention makes carrier tape device, described device mainly comprises a carrier tape extruder 20 and a processing die 100, and described processing die comprises an upper die holder 110 and lower die holder 120, upper die holder 110 A plurality of protrusions 112 are evenly and equidistantly arranged, and the lower mold base 120 is evenly arranged on the lower mold base 120 to match the protrusions 112 in the upper mold base 110. The processing area 130 of the belt 10 . The extruder 20 stores and heats the material used for making the carrier tape, and heats and melts the material for making the carrier tape, so that the processing mold 100 can be extruded and shaped. Usually, the ma...

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PUM

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Abstract

The invention discloses a device and method for manufacturing carrier bands. The upper and lower surface of each recessed part of a carrier band, which is manufactured by the device and the method provided by the invention, are directly attached between the upper mould seat and the lower mould seat of a processing mould, thus each upper surface and the lower surface are all in a flat state, the angle and the size of the carrier band are more precise, the bag thickness is uniform, furthermore, an excellent sealing force between the carrier band and the adhesive tape coated on the carrier band is obtained, so the adhesive tape is not easy to fall off, and the electronic component is not easy to fall out. At the same time, the side surfaces of the projecting part and recessed part of the upper mould seat and the lower mould seat of the device which processes the carrier band, are inclined planes, so the carrier bands, which have been processed and molded, can easily fall off from the inclined planes of the device, and thus the phenomenon that carrier bands are adhered on the upper mould seat or the lower mould seat, and then are tore or destroyed is avoided.

Description

technical field [0001] The invention relates to the technical field of packaging of electronic components, in particular to the technical field of manufacturing a carrier tape for packaging electronic components. Background technique [0002] Carrier tape is a continuous strip container used to hold small electronic components in the field of electronics industry. Most of it is a continuous strip structure formed by integral extrusion molding using PS, PC or other plastic materials. The carrier tape A plurality of recesses are usually equidistantly distributed on the carrier tape, and holes are provided on the bottom and sides of each recess. The electronic components can be placed in the recesses, and then glued to the recesses on the carrier tape with adhesive tape to cover each recess to prevent the electronic components from falling. [0003] The carrier tape is usually stored in rolls. When the carrier tape packed with electronic components is sent to the electronics f...

Claims

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Application Information

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IPC IPC(8): B29C59/02B29C69/02
Inventor 秦军
Owner SUZHOU CONPLAS TECH
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