Adamantyl benzocyclobutene monomer and synthesizing method of polymer of adamantyl benzocyclobutene monomer

Abstract

The invention relates to a high molecular material and discloses an adamantyl benzocyclobutene monomer and a synthesizing method of a polymer of the adamantyl benzocyclobutene monomer. According to the adamantyl benzocyclobutene monomer and the synthesizing method of the polymer of the adamantyl benzocyclobutene monomer, the structural formula of the adamantyl benzocyclobutene monomer is shown as the specification, wherein a formula in the specification is adamantane; a formula in the specification is benzocyclobutene; O is oxygen and Si is silicon; m and n are the quantities of substituent groups on 1, 3, 5 and 7 sites of the adamantane; the sum of the m and the n is smaller than or equal to 4; the n is more than or equal to 1 and less than or equal to 4; R1 is a first fat substituent group or a first aromatic substituent group; R2 is a second fat substituent group or a second aromatic substituent group; R3 is a third fat substituent group or a third aromatic substituent group. The adamantyl benzocyclobutene monomer prepared by the invention is used for carrying out a polymerization reaction to obtain an adamantyl benzocyclobutene monomer polymer. According to the adamantyl benzocyclobutene monomer and the synthesizing method of the polymer of the adamantyl benzocyclobutene monomer, the adamantyl benzocyclobutene monomer and the polymer thereof have low dielectric constants and low dielectric losses; the dielectric properties are good; meanwhile, the adamantyl benzocyclobutene monomer and the polymer thereof have higher hydrophobic property and heat resistance.

Description

technical field [0001] The invention relates to polymer materials, in particular to a synthesis method of benzocyclobutene monomers containing adamantane groups and polymers thereof. Background technique [0002] With the development of electronic science, high-performance polymer materials have an increasingly broad market, among which polymer materials with high heat resistance, low water absorption, and low dielectric constant can be used for interlayer dielectrics, substrate materials, bottom Filling materials, etc., are widely used in microelectronic packaging and aerospace industries. At present, in the field of electronic packaging, with the development of large-scale and ultra-large-scale integrated circuits, the influence of dielectric properties (permittivity ε and dielectric loss factor tanδ) on the substrate is very important. As high-frequency substrate technology and products occupy an increasingly important position, the development of high-frequency circuit ...

AI Technical Summary

Problems solved by technology

[0004] However, the dielectric constant of the current benzocyclobutene-based polymers is not low enough, and its hydrophobicity and heat resistance need to be further improved.

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