Wafer reaction chamber cleaning device

Abstract

The invention discloses a wafer reaction chamber cleaning device. The wafer reaction chamber cleaning device comprises arranging a vacuum pump and a nitrogen tank outside a reaction chamber and is composed of a cleaning facial disc and a mechanical hand, wherein the cleaning facial disc is arranged inside the reaction chamber and used for cleaning the reaction chamber and the lower facial disc of the cleaning facial disc is provided with a plurality of holes; the mechanical hand comprises a clamping unit, mechanical arms and a frame, the clamping unit is arranged at the ends of the mechanical arms and used for clamping the cleaning facial disc, the mechanical arms are movably mounted on the frame, and the clamping unit and the upper facial disc of the cleaning facial disc are connected through fixing units. The wafer reaction chamber cleaning device is simple in structure and convenient to use, can clean the reaction chamber by transmitting the cleaning facial disc through the mechanism arms without damaging the vacuum environment of the reaction chamber and further remove dirt inside the reaction chamber without opening and resetting the reaction chamber, thereby improving the technical progress during production application, saving the resetting time and reducing the rejection rate of wafers and the economic loss.

Description

technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a device for cleaning a wafer reaction chamber. Background technique [0002] In the semiconductor process, it is necessary to carry out the corresponding process on the wafer in a confined space. With the upgrading of the semiconductor integrated circuit manufacturing process, the requirements for the vacuum degree and purity involved in the processing environment are getting higher and higher. Therefore, when the wafer is in a closed chamber environment, if contamination occurs in the reaction chamber, the contamination particles will pollute the chamber and cause the process to fail to proceed normally. [0003] The current solution is to open the cavity of the reaction chamber, re-clean the inside of the chamber, close the cavity after cleaning, make the cavity in a sealed state, and then perform vacuum operation. Since opening the chamber for cleaning has destroyed th...

AI Technical Summary

Problems solved by technology

Since opening the chamber for cleaning has destroyed the vacuum environment in the chamber, it is necessary to re-adjust the machine to make the environment in the chamber meet the process requirements, which increases equipment costs and prolongs working hours.

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