Packaging structure and packaging method of integrated common mode choke

Abstract

The invention discloses a packaging structure of an integrated common mode choke and a packaging method of the integrated common mode choke, and belongs to the technical field of semiconductor packaging. The packaging structure of the integrated common mode choke comprises an upper-layer inductance coil (110) and a lower-layer inductance coil (120), wherein the upper-layer inductance coil (110) and the lower-layer inductance coil (120) are vertically distributed, are consistent in winding direction, are the same in number of turns, wire width and wire distance, and are not overlapped in the perpendicular direction, upper-layer metal columns (210) which are perpendicularly and upwards connected with the upper-layer inductance coil (110) are arranged on an inner port and an outer port of the upper-layer inductance coil (110) respectively, lower-layer metal columns (220) which are perpendicularly connected with the lower-layer inductance coil (120) are arranged on an inner port and an outer port of the lower-layer inductance coil (120) respectively, the perpendicular direction of the lower-layer metal columns (220) and the perpendicular direction of the upper-layer metal columns (210) are the same or opposite, and the lower-layer inductance coil (120) is manufactured through metal carriers and a wet etching technology. The packaging structure of the integrated common mode choke is small in size, flat and consistent in performance parameter, the loss of the integrated common mode choke can be reduced under the condition of the high frequency, performance of an EMI filter is improved, and the packaging structure is applicable to large-scale production.

Description

technical field [0001] The invention relates to a packaging structure of integrated common mode inductors and a packaging method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] EMI filters mainly use common-mode inductors. The complex EMI (electromagnetic interference) environment, high integration, and high power density determine the development prospects of EMI filters with low loss, modularization, and flatness. The traditional wire-wound common mode inductor includes a magnetizer and an enameled wire coil. The magnetizer is cylindrical, I-shaped, ring-shaped, etc. The enameled wire coil is wound on the outside of the magnetizer to form a coil. The commonly used industrial standard size is 0805 and 0603. Therefore, the traditional winding Common-mode inductors have disadvantages such as large volume and difficult flat shape, which affect the further development of EMI filters. [0003] Traditional wire-wound common-mod...

AI Technical Summary

Problems solved by technology

The traditional wire-wound common mode inductor includes a magnetizer and an enameled wire coil. The magnetizer is cylindrical, I-shaped, ring-shaped, etc. The enameled wire coil is wound on the outside of the magnetizer to form a coil. The commonly used industrial standard size is 0805 and 0603. Therefore, the traditional winding Common mode inductors have shortcomings such as large volume and difficult to achieve flat shape, which affect the further development of EMI filters

[0003] Traditional wire-wound common-mode inductors are...

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