LED, LED device and LED manufacture technology

Abstract

The invention provides an LED. The LED comprises chips, a left bracket, a right bracket, an inner packaging colloid body and an outer packaging colloid body, wherein the left bracket and the right bracket are opposite to each other; the chips are placed on the upper end surfaces of the brackets; the anode pins and the cathode pins of the chips are welded with the anode electrodes and the cathode electrodes of the brackets through metal wires; the left bracket as well as the right bracket has three areas; the inner packaging colloid body covers the chips, the metal wires and the upper end surfaces of the first areas of the left and right brackets, extends from a position between the left and right brackets to the lower end surfaces of the first areas of the left and right brackets, and covers the lower end surfaces of the first areas; the outer packaging colloid body covers the inner packaging colloid body and the second areas, extending out of the inner packaging colloid body, of the left and right brackets; the third areas of the left and right brackets extend out of the outer packaging colloid body. The invention further provides a device adopting the LED and a technology used for manufacturing the LED. According to the invention, when reflow soldering, processing and assembly are conducted on the product and a circuit board, stripping between the inner packaging colloid body and the outer packaging colloid body can be avoided, so that damage on the chips and the metal wires caused by stress is effectively reduced, and the comprehensive property of the product is improved.

Description

Technical field [0001] The invention relates to the field of LED packaging, in particular to an LED and an LED device. Background technique [0002] LED (Light Emitting Diode) is a solid-state semiconductor device that can convert electrical energy into light. At present, the existing LED includes a bracket for conducting and supporting, a housing, a chip fixed on the bracket, and To protect the encapsulant of the chip. The manufacturing method of the LED is to form a shell on the bracket first, and then encapsulate it with a sealant. The shell is generally composed of epoxy resin, acid anhydride, high-light diffusive filler and thermally stable plastic; the sealant generally uses silica gel or epoxy. Resin filling, the material properties of the two are far apart, and the shrinkage rate is different, which will cause the shell and the sealing compound to peel off during the reflow process and assembly with the circuit board, and therefore cause greater stress on the chip and th...

AI Technical Summary

Problems solved by technology

The manufacturing method of the LED is to form a shell on the bracket first, and then encapsulate it with a sealant. The shell is generally composed of epoxy resin, acid anhydrides, high-light diffusing fillers, and thermally stable plastics; the sealant is generally made of silica gel or epoxy resin. Resin filling, the material properties of the two are quite different, and the shrinkage rate is different, which will easily cause the shell and the sealant to peel off during reflow processing and assembly with the circuit board, and thus generate greater stress on the chip and metal wires. lead to abnormal failure of the product; at the same time, due to structural design defects and the retraction characteristics of the sealant, the sealant protecting the chip does not completely cover the chip after processing and subsequent use. As a result, the chip will be damaged in harsh environments (such as rain) and affect product quality

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