Wafer selection device

A wafer and pedestal technology, applied in the field of wafer selection devices, can solve problems such as affecting the normal operation of electronic components, wasting time and manpower, and indicating contamination of wafers, so as to reduce subsequent operation steps, prevent damage, and facilitate sorting operations. Effect

Inactive Publication Date: 2014-04-02
陆彩飞
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Because the cloth or black leather is easy to produce fine particles, which will cause pollution to the chip display and affect the normal operation of electronic components
[0003] Recently, there is a wafer sorting device, including a sorting platform. The sorting platform is installed on a support, and the picking platform is made of dark glass. The structure of the device is too simple, and the wafers need to be sorted manually after sorting , more troublesome, waste of time and manpower

Method used

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Embodiment Construction

[0015] The present invention will be further described below in conjunction with accompanying drawing.

[0016] As shown in the figure, a wafer selection device includes a base 1, the cross-sectional shape of the base 1 is a U-shaped structure, and two in-line support feet 2 are arranged under the base 1, and the base 1 The middle part is upwardly provided with a selection platform 3, and a layer of black glass 21 is laid on the selection platform 3, and a layer of glass sticker 22 is pasted on the lower surface of the black glass 21, and the cross-sectional shape of the selection platform 3 is an isosceles trapezoid , the bases at the left and right ends of the selection platform 3 are respectively provided with a finished product transmission groove 4 and a waste product transmission groove 5, and the finished product transmission groove 4 is provided with a finished product conveyor belt 6, and the right side of the finished product conveyor belt 6 A first driven wheel 9 is...

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PUM

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Abstract

The invention relates to a wafer selection device, which comprises a substrate, wherein two transverse-line-shaped supporting feet are arranged below the substrate; the middle of the substrate is upwards provided with a selection platform; the parts on the left end and the right end of the selection platform, of the substrate, are respectively provided with a finished product conveying groove and a reject conveying groove; a finished product conveying belt is arranged in the finished product conveying groove; the right side driving wheel of the finished product conveying belt is fixedly provided with a first driven wheel by a bearing; a reject conveying belt is arranged in the waste conveying groove; the left side driving wheel of the reject conveying belt is fixedly provided with a second driven wheel by a bearing; the outer side of the finished product conveying groove and the outer side of the reject conveying groove are respectively provided with a finished product receiving hole and a reject receiving hole; a support plate is arranged between the supporting feet and is provided with a drive wheel, a third driven wheel, a fourth driven wheel and a fifth driven wheel; therefore, manpower is greatly saved and cost is greatly reduced.

Description

technical field [0001] The invention relates to a wafer selection device, which is applied in the field of wafer processing. Background technique [0002] During the silicon wafer selection process, trays are generally used for wafer selection. Since the processed wafers are thin and small in size, it is necessary to cover the tray with black cloth or black leather to facilitate wafer selection. Because the cloth or black leather is easy to produce fine debris, it will pollute the chip display and affect the normal operation of electronic components. [0003] Recently, there is a wafer sorting device, which includes a sorting platform. The sorting platform is installed on a support, and the picking platform is made of dark glass. The structure of the device is too simple, and the wafers need to be sorted manually after sorting , more troublesome, waste of time and manpower. Contents of the invention [0004] The technical problem to be solved by the present invention is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67271
Inventor 聂金根
Owner 陆彩飞
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