Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Adhesive used for semiconductor wafer cutting

A technology of adhesives and semiconductors, applied in the direction of adhesives, adhesive additives, epoxy resin glue, etc., can solve the problems of many bright edges, high defective rate, and high chip drop rate, and achieve easy degumming, good toughness, and improved The effect of excellent product rate

Active Publication Date: 2015-04-15
广西拓源新材料有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing adhesives have problems such as high chip loss rate, many bright edges, and high defective rate.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adhesive used for semiconductor wafer cutting
  • Adhesive used for semiconductor wafer cutting
  • Adhesive used for semiconductor wafer cutting

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A kind of adhesive that is used for semiconductor wafer dicing, comprises resin component and curing agent component, and wherein resin component is made up of the raw material of following weight component:

[0017]

[0018] Curing agent component has the weight parts composition of following component:

[0019]

[0020]

[0021] Wherein the epoxy resin modified m-xylylenediamine prepolymer is made up of the parts by weight of the following components:

[0022] m-Xylylenediamine 75

[0023] 2,4,6-tris(dimethylaminomethyl)phenol 1.5 with gas chemical grade K54

[0024] Epoxy resin E51 23.5

[0025] Prepared by the following method:

[0026] Step 1, prepare the resin component: E51, diglycidyl tetrahydrophthalate S-182, 1,4 -Butanediol diglycidyl ester, titanium dioxide, quartz powder, γ-glycidyl ether propyl trimethoxysilane, and gas phase titanium dioxide are dispersed and ground by a three-roll machine, and degassed by a vacuum bubble machine, and then th...

Embodiment 2

[0031] A kind of adhesive that is used for semiconductor wafer dicing, comprises resin component and curing agent component, and wherein resin component is made up of the weight part of following component:

[0032]

[0033] Curing agent component has the weight parts composition of following component:

[0034]

[0035]

[0036] Wherein the epoxy resin modified m-xylylenediamine prepolymer is made up of the parts by weight of the following components:

[0037] m-Xylylenediamine 75

[0038] 2,4,6-tris(dimethylaminomethyl)phenol 1.5 with gas chemical grade K54

[0039] Epoxy resin E51 23.5

[0040] The preparation method is as follows:

[0041] Step 1, preparation of the resin component: take by weight the epoxy resin E51, diglycidyl tetrahydrophthalate S- 182. Hexahydrophthalic acid diglycidyl ether S-184, 1,4-butanediol diglycidyl ester, titanium dioxide, quartz powder, γ-glycidyl ether propyl trimethoxysilane, gas-phase titanium dioxide after dispersion It is g...

Embodiment 3

[0046] A kind of adhesive that is used for semiconductor wafer dicing, comprises resin component and curing agent component, and wherein resin component is made up of the weight part of following component:

[0047]

[0048] Curing agent component has the weight parts composition of following component:

[0049]

[0050]Wherein the epoxy resin modified m-xylylenediamine prepolymer is made up of the parts by weight of the following components:

[0051] m-Xylylenediamine 75

[0052] 2,4,6-tris(dimethylaminomethyl)phenol 1.5 with gas chemical grade K54

[0053] Epoxy resin E51 23.5

[0054] The preparation method is as follows:

[0055] Step 1, preparation of the resin component: take by weight the epoxy resin E51, diglycidyl tetrahydrophthalate S- 182. Hexahydrophthalic acid diglycidyl ether S-184, 1,4-butanediol diglycidyl ester, titanium dioxide, quartz powder, precipitated barium sulfate, γ-glycidyl ether propyl trimethoxysilane, gas phase After the titanium dioxid...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an adhesive used for the semiconductor wafer cutting. The adhesive comprises a resin component and a curing agent component, and the resin component comprises an epoxy resin, phthalic acid diglycidyl ether, an active diluent and the like; and the curing agent component comprises an epoxy resin modified m-xylylenediamine prepolymer, polymercaptan, a thixotropic agent and the like. The adhesive has the characteristics of easy degumming, high hardness, good toughness and the like, is suitable for the cutting of thinner wafers, can reduce the wafer falling and luminance edges, and improves the excellent product rate.

Description

technical field [0001] The invention relates to an adhesive, in particular to an adhesive used in cutting semiconductor wafers. Background technique [0002] During the cutting process of semiconductor wafers, due to various reasons, complete ingots may fall off or part of the wafers may be broken, bright edges, etc. However, better quality wafers can be obtained by coating with an adhesive followed by dicing, followed by debonding and cleaning. However, the existing adhesives have problems such as high chip loss rate, many bright edges, and high defective rate. Contents of the invention [0003] In view of the above problems, the adhesive described in the present invention has the characteristics of easy degumming, high hardness and good toughness, and is suitable for cutting thinner wafers, while reducing chip loss, bright edges and high quality products. [0004] The technical solution provided by the present invention is: an adhesive for cutting semiconductor wafers,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/06
Inventor 韦祖睦苏光临陈韬
Owner 广西拓源新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com