A positive electrode oxide film printed substrate for a power module

Abstract

The invention discloses a positive electrode oxidation film printing substrate used for a power module. The substrate comprises an aluminum heat dissipating plate (1), wherein the upper plate face and the lower plate face of the aluminum heat dissipating plate (1) are respectively provided with an oxidization film layer (2) having the insulating effect, an insulating paste layer (3) is printed on the oxidization film layer (2) on the upper face, conductor paste (4) forming a DBC substrate circuit is printed on the upper surface of the insulating paste layer (3), a chip is welded to the conductor paste (4), and the chip is connected with the DBC substrate circuit. The positive electrode oxidation film printing substrate solves the problems that the heat dissipating plate bends and deforms, and air holes are generated in the welding process, the production technology is simplified, the substrate is convenient to machine and manufacture, the heat dissipating effect is effectively guaranteed while the manufacturing cost is lowered, and the service life of the positive electrode oxidation film printing substrate is greatly prolonged.

Description

technical field [0001] The present invention relates to an automobile electrical component, in particular to a positive electrode oxide film printed substrate for a power supply module. Background technique [0002] Generally, semiconductor chips are mounted on a DBC substrate, and then the substrate is soldered to a heat sink (copper, aluminum). The current semiconductor power module products are modularized into SPM (Smart Power Module), diode module, etc. IGBT modules and more. [0003] Many problems arise in the soldering process required to manufacture the above-mentioned products. Among them, the welding process of the heat sink plate and the DBC substrate is to dissipate the thermal stress generated in the semiconductor chip, so that the internal devices can work normally. If the generated heat cannot be dissipated, it will cause damage to internal devices and cause undesirable phenomena. Generally, semiconductor power modules such as MOSFETs and IGBTs, which are ...

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Problems solved by technology

This heat will overload the semiconductor power module, cause the device to malfunction and eventually fail, and shorten the life of the product as the durability of the device decreases

[0004] However, according to the above method, air holes will inevitably be generated when the heat dissipation plate and the DBC substrate are welded, resulting in a decrease in heat dissipation function.

In order to solve this problem, welding is generally carried out in a vacuum state, but the investment in equipment costs and maintenance costs are too high, and it is necessary to use X-ray to confirm whether the welding is complete, and even if X-ray is used to detect, it cannot Completely confirm whether there are pores, so usually put the product into water, and use ultrasonic waves to confirm whether there are pores, so that the tested product can no longer be used, and can only be tested by random sampling, so it will lead to manufacturing costs Increase

[0005] In addition, when welding the heat sink and the DBC substrate, due to the principle of thermal expansion and contraction, the heat sink may bend, and the bending will make the central part protrude, which will hinder heat dissipation after installation

In order to solve this kind of problem, when the heat sink is processed, the back of the curved part is bent to a certain arc to process, but to solve the problem of the curved part in this way, the quality of the product cannot be completely guaranteed, because the passage of time after welding, The original bent part may recover, causing the DBC substrate to separate from the heat sink

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