A positive electrode oxide film printed substrate for a power module

A technology of power modules and printed substrates, which is applied to printed circuit parts, circuits, electrical components, etc., can solve problems such as incomplete guarantee of product quality, high equipment costs and maintenance costs, and detachment of DBC substrates, so as to avoid the decline of heat dissipation characteristics, Low manufacturing cost, ensure the effect of heat dissipation
CN103716980BActive Publication Date: 2017-12-05NANTONG YOUYUAN ART PATTERN DESIGN CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
NANTONG YOUYUAN ART PATTERN DESIGN CO LTD
Publication Date
2017-12-05

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Abstract

The invention discloses a positive electrode oxidation film printing substrate used for a power module. The substrate comprises an aluminum heat dissipating plate (1), wherein the upper plate face and the lower plate face of the aluminum heat dissipating plate (1) are respectively provided with an oxidization film layer (2) having the insulating effect, an insulating paste layer (3) is printed on the oxidization film layer (2) on the upper face, conductor paste (4) forming a DBC substrate circuit is printed on the upper surface of the insulating paste layer (3), a chip is welded to the conductor paste (4), and the chip is connected with the DBC substrate circuit. The positive electrode oxidation film printing substrate solves the problems that the heat dissipating plate bends and deforms, and air holes are generated in the welding process, the production technology is simplified, the substrate is convenient to machine and manufacture, the heat dissipating effect is effectively guaranteed while the manufacturing cost is lowered, and the service life of the positive electrode oxidation film printing substrate is greatly prolonged.
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Description

technical field

[0001] The present invention relates to an automobile electrical component, in particular to a positive electrode oxide film printed substrate for a power supply module. Background technique

[0002] Generally, semiconductor chips are mounted on a DBC substrate, and then the substrate is soldered to a heat sink (copper, aluminum). The current semiconductor power module products are modularized into SPM (Smart Power Module), diode module, etc. IGBT modules and more.

[0003] Many problems arise in the soldering process required to manufacture the above-mentioned products. Among them, the welding process of the heat sink plate and the DBC substrate is to dissipate the thermal stress generated in the semiconductor chip, so that the internal devices can work normally. If the generated heat cannot be dissipated, it will cause damage to internal devices and cause undesirable phenomena. Generally, semiconductor power modules such as MOSFETs and IGBTs, which are ...

Claims

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