Light emitting diode with heat release effect

A technology of light-emitting diodes and heat release, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of short working life, reduced transparency, and unreliability of LED chips, and achieve the effect of excellent heat release performance

Inactive Publication Date: 2014-04-16
青岛威力电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the LED chip is heated, and there is a problem that the luminance of light emission decreases.
In addition, the working life of the LED chip becomes shorter when working at a higher temperature
In addition, there is a problem that the transparent sealing body that seals the LED chip is discolored due to heat, and the transparency is lowered
In addition, there is the problem that LED chips tend to have shorter working life and are less reliable when used in high output and high brightness applications

Method used

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  • Light emitting diode with heat release effect
  • Light emitting diode with heat release effect
  • Light emitting diode with heat release effect

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Such as figure 1 As shown, a light emitting diode 1 includes an LED chip 4 , an insulating circuit substrate 3 in which the LED chip 4 is disposed, and a printed wiring board 2 . The insulating circuit substrate 3 is made of glass epoxy, silicone or the like. Provided on the circuit substrate 3 are a pair of integrally formed upper and lower surface electrodes 5a, 6a and 5b, 6b.

[0019] The circuit substrate 3 has a heat radiation mechanism 7 . Radiation mechanism 7 comprises a heat radiation part 9, and it is in figure 1 is arranged in the storage portion 8 formed in the substantially central portion of the circuit substrate 3 in the embodiment shown in . The storage portion 8 includes, for example, a through hole formed in the circuit substrate 3 . When the heat radiation member 9 is inserted in the storage portion 8, the heat radiation member 9 is arranged to contact the surface of the printed wiring board 2 through the lower electrode 6a, the printed wiring b...

Embodiment 2

[0029] Such as figure 2 As shown, in the second embodiment, the same numerals are added to similar parts in the first embodiment.

[0030] The second embodiment differs from the first embodiment in that the heat radiation member 9 placed in the storage portion 8 of the through hole is not used. The recess 21 is formed by providing a recessed portion 22 so that a portion of the innermost portion of the circuit substrate 8 made of insulating glass epoxy resin remains as thin as possible. The LED chip 4 is inserted into the recessed portion 22 and mounted on the innermost side of the recess 21 . The LED chip 4 is fixed in the innermost part of the recess 2 by a transparent adhesive or the like, similar to the first embodiment described above.

[0031] Similarly as in the first embodiment, the sealing body 12 made of transparent resin is provided on the recessed portion 22 and the upper surface of the circuit substrate 3 to cover the LED chip 4 .

[0032] The light emitting di...

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PUM

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Abstract

The invention relates to a light emitting diode used for commercial devices such as personal computers, printers, PDAs (personal digital assistant), fax machines, paging sets and mobile telephones, in particular to a light emitting diode with the heat release effect. The light emitting diode comprises a circuit substrate, an LED chip and a heat radiation part and further comprises a sealing body which is arranged on the LED chip to seal the LED chip, and the heat radiation part is made of Al. The light emitting diode is high in brightness, the service life of the LED chip cannot be shortened when the light emitting diode works at high temperature, and the light emitting diode has good heat release performance.

Description

technical field [0001] The present invention relates to light emitting diodes for commercial devices such as personal computers, printers, PDAs (personal digital assistants), facsimiles, pagers and mobile phones, and more particularly, to a light emitting diode having excellent heat release effect. Background technique [0002] Conventionally, in surface mount light-emitting diodes that pursue slimming and miniaturization of electron devices, there is a known structure in which LED chips are mounted on electrode patterns formed on the upper surface of a glass epoxy resin substrate, and the transparent resin is covered with Provided on a substrate to seal the LED chip. [0003] image 3 A light emitting diode 30 as disclosed in this patent document is illustrated. In the structure that the light-emitting diode 30 has, the upper surface electrodes 32a, 32b and the lower surface electrodes 33a, 33b integrated and plated on the circuit substrate 31 are patterned to surround a p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/641
Inventor 不公告发明人
Owner 青岛威力电子科技有限公司
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