Thermal transfer device with reduced vertical profile

Abstract

A heat transfer device with reduced vertical section. The device includes a condenser with generally vertical internal cooling fins. The inlet directs the heat transfer fluid in vapor state to the top of the cooling fins where the vapor condenses and flows along the fins to the bottom of the condenser. The bottom of the condenser is angled towards the outlet to direct the liquid heat transfer fluid to a reservoir for holding the fluid. Both the inlet and the outlet are arranged at a height above the level of the heat transfer fluid in liquid state in the reservoir. The arrangement may also include fins on the exterior of the condenser to provide a cooling surface that is not in contact with the heat transfer fluid in liquid or vapor state.

Description

technical field

[0001] The present invention relates to a heat transfer device, such as a closed loop fluid cooling system, having at least one evaporator, at least one condenser and one or more fluid conduits connecting the evaporator to the condensing connected to a heat transfer device for indirect cooling of an object using a cooling fluid, and more particularly, the present invention relates to a heat transfer device with reduced vertical profile for directing a cooling fluid in a compact environment with Objects to be cooled are in indirect thermal contact. Background technique

[0002] Passive closed loop two-phase fluid cooling systems are well known heat transfer devices for cooling objects that generate excessive heat, such as but not limited to computer chips. The term "passive" is intended to mean a system in which cooling fluid is circulated without the use of a mechanical pump. The power used to circulate a fluid in a passive system comes from changes in buoy...

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