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Hollow plate edge bonding forming system

A hollow and plate sealing technology, applied in the field of sheet edge sealing, can solve the problems of easy entry of water vapor into the hollow plate, cuts by staff, inconvenient operation, etc., and achieves the effect of simple structure, improved product quality and output, and good edge sealing effect.

Inactive Publication Date: 2014-04-30
SUZHOU HOLDEN AUTO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the hollow board is cut and processed, its edges generally need to be edge-sealed. The reason is that if the edge is not processed, water vapor will easily enter the hollow board; it will affect the appearance and may cause the staff to cut by the exposed edge of the board
At present, the edge banding treatment of hollow boards is mostly realized directly by coating or wrapping sealing materials on the edges of hollow boards, which is inconvenient to operate, low in efficiency and high in cost

Method used

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  • Hollow plate edge bonding forming system
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Examples

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Embodiment Construction

[0023] refer to figure 2 It is a preferred embodiment of the present invention, which relates to a hollow plate edge banding forming system comprising:

[0024] at least a heating unit 21 for heating the side edge of the hollow plate to soften,

[0025] at least a thermal cutting unit 22 for cutting the ribs in the side edges of the softened hollow panel,

[0026] A heat closing unit 23 for closing the side edge of the cut hollow plate,

[0027] A thermoforming unit 24 for processing the side edge of the closed hollow plate into a set shape, and

[0028] The cooling forming unit 25 is used for cooling and shaping the side edge of the hollow plate with a set shape.

[0029] Furthermore, the heating unit 21 includes a mechanism for providing high-temperature gas sufficient to soften the side of the hollow plate, for example, a mechanism that can provide high-temperature steam, high-temperature hot air, and the like.

[0030] The thermal cutting unit 22 includes a cutter hea...

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Abstract

The invention discloses a hollow plate edge bonding forming system. The hollow plate bonding forming system comprises a heating unit which is at least used for heating the side part of a hollow plate until softening, a thermal cutting unit which is at least used for cutting a reinforcing rib in the side part of the softened hollow plate, a hot contracting unit for contracting the side part of the cut hollow plate, a thermal forming unit for processing the side part of the contracted hollow plate to be in a set sealing form and a cooling forming unit for cooling the side part of the hollow plate with a set form for forming. The hollow plate edge bonding forming system has the advantages that the structure is simple, the manufacture cost is low, the cutting location of the hollow plate is accurate, the edge bonding effect is good, the cost is effectively lowered, the product quality is improved, and the yield is increased.

Description

technical field [0001] The invention relates to a hollow plate edge banding forming system, which belongs to the technical field of plate edge banding. Background technique [0002] At present, hollow boards are widely used in the fields of electronics, packaging, machinery, light industry, decoration, optomagnetic technology, and bioengineering medicine and health. figure 1 What is shown is a hollow board commonly used at present, which includes two board bodies 101 arranged in parallel, and the two board bodies are connected by a plurality of reinforcing ribs 102 . After the hollow board is cut and processed, its edges generally need to be edge-sealed. The reason is that if the edge is not processed, water vapor will easily enter the hollow board; it will affect the appearance and may cause the staff to Cut by the exposed edge of the board. At present, most of the edge banding treatment of hollow boards is realized directly by coating or wrapping sealing materials on the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C69/00B29C65/10B29C51/18
Inventor 樊新平吴红英刘志平
Owner SUZHOU HOLDEN AUTO
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