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Semiconductor refrigeration camera and semiconductor refrigeration device thereof

A refrigeration device and semiconductor technology, applied in the field of cameras, can solve problems such as uncollected data and no discovery, and achieve the effects of improving heat dissipation and refrigeration efficiency, avoiding energy loss, and improving refrigeration efficiency

Inactive Publication Date: 2014-04-30
上海福泽工业自动化设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no description or report of the similar technology of the present invention, and no similar data at home and abroad have been collected yet.

Method used

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  • Semiconductor refrigeration camera and semiconductor refrigeration device thereof
  • Semiconductor refrigeration camera and semiconductor refrigeration device thereof
  • Semiconductor refrigeration camera and semiconductor refrigeration device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051]This embodiment provides a semiconductor refrigeration device, including a heat sink base plate, a semiconductor cooling fin, a cooling fin at a heat dissipation end, and a cooling fin at a cooling end. In close contact with the bottom plate of the heat sink; the heat sink at the heat dissipation end is installed on the outer surface of the bottom plate of the heat sink and is in close contact with the bottom plate of the heat sink; the heat sink at the cooling end is installed on the cooling surface of the semiconductor refrigeration sheet and is connected face in close contact.

[0052] Further, the semiconductor refrigeration device also includes any one or more of the following components:

[0053] - a protective cover, the bottom plate of the heat sink is inserted on one end surface of the protective cover, the semiconductor cooling fin is installed on the inner side of the bottom plate of the cooling fin, and the cooling surface of the semiconductor cooling fin fac...

Embodiment 2

[0062] This embodiment provides a semiconductor refrigeration camera, including a camera and the semiconductor refrigeration device provided in Embodiment 1, the camera is arranged inside the protective cover of the semiconductor refrigeration device, and the front end surface of the protective cover is provided with a camera for shooting Transparent windows.

[0063] Further, the peltier cooling camera further includes a bottom mounting plate, the bottom mounting plate is arranged on the bottom surface inside the protective cover, and the temperature control switch and / or the camera are mounted on the bottom mounting plate.

[0064] Further, the fan is installed at the rear end inside the protective cover.

[0065] This embodiment is specifically:

[0066] Such as figure 1 , 2 , 7, the semiconductor cooling camera provided by the present embodiment, the semiconductor cooling chip 16 is installed on the heat sink base plate 4, and the heat sink base plate 4 passes through t...

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Abstract

The invention provides a semiconductor refrigeration camera and a semiconductor refrigeration device of the semiconductor refrigeration camera. The semiconductor refrigeration device comprises a cooling fin bottom plate, a semiconductor chilling plate, a heat dissipation end cooling fin and a refrigeration end cooling fin, wherein the semiconductor chilling plate is installed on the cooling fin bottom plate, and the heat dissipation face of the semiconductor chilling plate is in close contact with the cooling fin bottom plate; the heat dissipation end cooling fin is installed on the outer side face of the cooling fin bottom plate and is in close contact with the cooling fin bottom plate; the refrigeration end cooling fin is installed on the refrigeration face of the semiconductor chilling plate and is in close contact with the refrigeration face of the semiconductor chilling plate; the semiconductor refrigeration camera is installed in a protective cover of the semiconductor refrigeration device. According to the semiconductor refrigeration camera and the semiconductor refrigeration device of the semiconductor refrigeration camera, since electric energy is used for driving semiconductor refrigeration, video surveillance on a high-temperature industrial occasion and a special occasion is realized, the installation efficiency and use efficiency of the high-temperature camera are improved, energy consumption is lowered, and the semiconductor refrigeration camera and the semiconductor refrigeration device of the semiconductor refrigeration camera are environmentally friendly.

Description

technical field [0001] The invention relates to the technical field of cameras, in particular to a semiconductor cooling camera and a semiconductor cooling device thereof. Background technique [0002] Generally, the upper limit of the operating temperature of the camera is basically 50°C. In an industrial site, if the ambient temperature exceeds 50°C, the general camera will not be able to be used for a long time. Usually in such high-temperature occasions, air-cooling and water-cooling methods are generally used to cool the camera to the normal working range, so that it can work for a long time in high-temperature occasions. But in some occasions where water and gas cannot be delivered, on-site monitoring becomes a problem. [0003] Semiconductor refrigeration is a kind of heat pump. Its advantage is that it has no sliding parts, and it is used in some occasions where the space is limited, the reliability is high, and there is no refrigerant pollution. It is the use of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225H05K7/20
Inventor 黄晓添董明涛江杨杨强红吴海波刘天托
Owner 上海福泽工业自动化设备有限公司
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