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infrared sensor

An infrared sensor and sensor technology, applied in the direction of instruments, scientific instruments, semiconductor devices, etc., can solve the problems of distortion thermal effect, incomplete sensor chip thermal coupling, etc., and achieve the effect of improving measurement accuracy

Active Publication Date: 2017-06-16
精量电子(德国)公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the external diaphragm is only incompletely thermally coupled to the sensor chip both structurally and in terms of material choice (plastic or ceramic)
That is, there are thermal effects that can distort the results

Method used

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Embodiment Construction

[0095] figure 1 The infrared sensor assembly shown in the previous link is based on figure 2 An infrared sensor 4 is depicted, which is mounted on a base plate 2 in a TO (transistor-type) housing 1 . The housing is surrounded by composite heat balancing elements (“heat sinks”) 12 , 13 . The heat balance elements 12 and 13 are made of materials with good thermal conductivity (such as brass, aluminum, copper, etc.), and adopt thick-wall design (wall thickness>1.5mm). The IR sensor assembly is constructed such that the bottom plate 2 and the top surfaces of the lenses 3, 6 of the TO housing 1 and the two constituent parts of the thermal balancing elements 12, 13 have good thermal connections 14a-c. This good thermal connection 14a-c can be achieved, for example, by pressing or screwing 14a as well as by pressing 14b,c.

[0096] The diaphragm 10 and the beam dump 11 are integrated in the upper thermal balance element 12, so that these two components are also in a good thermal ...

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Abstract

An infrared sensor assembly using an infrared sensor 4 mounted on a base plate 2 in a TO (transistor type) housing 1 . The housing is surrounded by composite heat balancing elements (“heat sinks”) 12 , 13 . The thermal balance elements 12 and 13 are made of materials with good thermal conductivity (eg brass, aluminum, copper, etc.), and are designed with thick walls (wall thickness 5mm). The infrared sensor assembly is constructed such that the top surfaces of the lenses 3, 6 of the base plate 2 and the TO housing 1 and both components of the thermal balance elements 12, 13 have good thermal connections 14a-c. The diaphragm 10 and the beam collector 11 are integrated in the upper thermal balance element 12, so that these two components are also in a state of good thermal coupling. This enables rays 8 located in the field of view to reach the sensor element 4 further. Furthermore, rays 9a that do not reach the sensor element 4 after a single transmission can also enter the housing. On the other hand, the ray 9b with a larger incident angle that can reach the sensor element through multiple reflections does not hit the lens 6 directly. This part of the radiation is absorbed in the beam dump 11 .

Description

technical field [0001] The present invention relates to an infrared (IR) sensor assembly comprising: [0002] - an infrared sensor element having a radiation-sensitive area for detecting infrared rays, [0003] - a first optical element, which is arranged in front of the infrared sensor element as seen from the direction of incidence, wherein the optical element may have one or more of the following components: [0004] - refracting surfaces, [0005] - mirror surface, [0006] - aperture, [0007] - wavelength dependent filters, [0008] Wherein, the size of the first optical element and the infrared sensor element specifies the infrared beam incident from the outside as the expected field of view of the infrared sensor element, and the infrared beam incident from the outside [0009] - if a refractive surface is provided as an integral part of said first optical element, this refractive surface is traversed only once, [0010] - if a mirror is provided as an integral p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/08G01J5/02G01J5/06
CPCG01J5/0205G01J5/06G01J5/0893H01L31/02325G01J5/07G01J5/0802G01J5/0808H01L31/0232
Inventor 斯蒂芬·罗星格托比亚斯·瑟皮特斯迈克尔·巴塞尔
Owner 精量电子(德国)公司