Clamp for sputtering and method for sputtering semiconductor package

Abstract

The invention provides a clamp for sputtering and a method for sputtering a semiconductor package. The clamp comprises a bearing plate having a groove, an adhering layer disposed at the bottom face of the groove and provided with an object setting area at the top face, and a jig plate which is combined with the adhering layer and is embedded in the groove of the bearing plate and is provided with a first opening corresponding to the object setting area. The cross section of the first opening of the jig plate is in the shape of an oval, which is narrow at bottom and wide at top, and a predetermined distance is disposed between the edge of the object setting area and the bottom end of the first opening. Accordingly, the bottom part of the semiconductor package can be prevented from sputtering, and the yield of the semiconductor packages can be increased.

Description

technical field

[0001] The invention relates to a jig structure and a method for manufacturing a semiconductor package, in particular to a jig used in a sputtering process and a method for sputtering a semiconductor package. Background technique

[0002] A general semiconductor package is manufactured by electrically connecting a semiconductor chip to a carrier such as a lead frame or a package substrate, and then covering the semiconductor chip with an encapsulant on the carrier to prevent the semiconductor chip from being exposed to the outside atmosphere. contact, and thus protect against moisture or pollutants. However, when the semiconductor package is in operation, it will suffer from external electromagnetic interference (EMI) to some extent, which will cause the electrical operation function of the semiconductor package to be abnormal, thus affecting the overall electrical performance of the semiconductor package. . In view of the aforementioned EMI problems, metal...

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