Internal fluid heat exchange system

Abstract

An internal source fluid heat exchange system that uses the working heat from the internal nodes of the semiconductor integrated module as the source power to promote the phase conversion heat of the working fluid cycle, and is characterized in that it has a fluid working medium evaporation tube, an evaporation channel, and an evaporation chamber. The throttling valve is connected to the heat exchange base plate of the cycle, and through the mutual matching of the formula dosage of the working fluid in the power structure, two modes of phase change cycle heat exchange of the working fluid are carried out. One is the direct evaporation of the working fluid, which is called direct The exchange system, the other is the phase change heat method in which the working fluid first produces gas and then evaporates, called the exchange system, which generates working heat immediately and performs heat exchange and heat dissipation through the phase change cycle. According to various types of high-power semiconductor integration The module needs to achieve the purpose of quantitatively controlling its working temperature rise, and can be widely used in various computers, power supplies, LEDs, power amplifiers, lasers, radars, infrared and other equipment.

Description

technical field [0001] The invention relates to a device for exchanging working heat of a high-power semiconductor integrated module, in particular to an internal source fluid heat exchange system formed by using the working heat from the internal nodes of the semiconductor integrated module as the source power to promote the circulating phase transformation heat of working fluid. Background technique [0002] At present, the integration degree of semiconductor integrated modules is getting higher and higher, the power is getting higher and higher, and the heat generated with their work is also increasing. If there is no effective cooling solution, it will become a "heating core" and cannot work, for example: Highly integrated 300W LED at room temperature, no matter what kind of heat sink made of good conductor is used, due to the slow conduction speed of solid materials, the temperature of the LED substrate will exceed 80°C within a few minutes and enter power-off protection...

AI Technical Summary

Problems solved by technology

[0002] At present, the integration degree of semiconductor integrated modules is getting higher and higher, the power is getting higher and higher, and the heat generated with their work is also increasing. If there is no effective cooling solution, it will become a "heating core" and cannot work, for example: Highly integrated 300W LED at room temperature, no matter what kind of heat sink made of good conductor is used, due to the slow conduction speed of solid materials, the temperature of the LED substrate will exceed 80°C within a few minutes and enter power-off protection. In the dedicated network server , The special field of the supercomputer room continues to use ordinary good conductor conduction radiators, and does not solve the heating problem for individual semiconductor modules. The dry and low-temperature air is delivered by a large central air conditioner through the air duct formed by the closed chassis, and the heat is exchanged in an orderly manner. Due to excessive consumption The cost of water and electricity is very high, and it is impossible to promote it. However, without using air duct cooling, the heat generation problem is specially solved for various semiconductor modules individually, and the heat is dissipated in an open environment. When the temperature is higher than 24°C, the passive conduction heat dissipation method is no longer possible. To reduce the working temperature to the appropriate working temperature, only the active low-temperature heat exchange method can control the working temperature rise of this type of heat source. At present, all commercialized heat exchange systems that reduce the working temperature rise cannot use the high-power semiconductor integrated module. It is the source of power to promote the circulation of working fluid for phase-change heat, and it has not been able to achieve self-contained and miniaturized. When it comes to the conversion of high-power energy forms, compressor refrigeration or slow-release refrigerant is generally used to intervene, and the cooling capacity is transferred by the pipeline. Input the hot end of the semiconductor integrated module for single external heat exchange. Because of its difficult independent structure, high energy consumption, heavy weight, poor stress, and high cost, it can only be applied to individual large-scale equipment that allows towing accessories. Although it is a good conductor Conduction heat dissipation has advanced to fluid heat exchange and heat dissipation, but it is only in its infancy and cannot be widely used in various high-power semiconductor integrated modules

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