Manufacturing method of heat dissipation module and heat dissipation bottom plate
A technology of heat dissipation base plate and heat dissipation module, which is applied in the fields of instruments, electrical digital data processing, digital data processing parts, etc. The overall performance is greatly affected, the heat transfer of the cooling module is declining, etc., to achieve the effect of high price, excellent strength, and difficult size control
Active Publication Date: 2016-12-21
SY THERMAL
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Problems solved by technology
However, the total thickness of the copper base plate and the heat pipe violates the requirement of thinning the heat dissipation module
Therefore, the known technology cannot solve the problems of ultra-thin laptop multi-core CPU hotspots and thinning at the same time
In addition, when the heat pipe becomes thinner, the heat transfer rate of the cooling module will drop rapidly, which will have a great impact on the overall performance of the ultra-thin notebook. If you want to directly improve the design parameters and structure of the ultra-thin heat pipe, it will be extremely difficult and costly
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[0070] In order to make the above-mentioned purpose, features and advantages of the present invention more obvious and easy to understand, the thin heat dissipation module provided by the present invention below specifically cites preferred embodiments, together with the accompanying drawings, and is described in detail as follows (below The laptop is a notebook computer, and the "ㄇ-shape" described in the present invention is only to illustrate the shape of a groove whose cross section is a frame-shaped opening on one side, and has nothing to do with the opening direction).
[0071] As mentioned in the previous art, the multi-core CPU of the ultra-thin notebook often has hot spots and their positions are not fixed. When hot spots appear on the heat dissipation bottom plate outside the coverage of the heat pipe, the known aluminum extruded or aluminum die-cast heat dissipation bottom plate will cause the laptop to crash due to insufficient heat conduction capability. Therefore...
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The invention discloses a thermal module manufacturing method and a cooling bottom plate. The thermal module and the cooling bottom plate are used for cooling a chip of a thin computer. The cooling bottom plate comprises a strip opening frame-shaped heat pipe holding groove, the holding groove comprises a pair of convex rib side walls with obvious mirror symmetry, a flash groove is close to the pair of convex rib side walls, when the bottom plate is forged and processed, the flash groove is used for allowing one part of materials of the pair of convex ribs to flash when the pair of convex ribs coats the heat pipe so that the bottom of the heat pipe and the cooling bottom plate can make up a plane; a plurality of flash ditches are formed in the strip opening frame-shaped top of the cooling bottom plate so that materials on the flash ditch banks are capable of flashing to the flash ditches to lower the thicknesses when the strip opening frame-shaped top of the cooling bottom plate is forged into a plane. The thermal module and the cooling bottom plate enable hot spots of a multi-core CPU to be corresponding to the heat pipe.
Description
technical field [0001] The present invention relates to a heat dissipation module, in particular to a method for manufacturing the heat dissipation module and a heat dissipation bottom plate. Background technique [0002] The overall thickness of ultra-thin notebook computers (including LED LCD screen + host + chassis itself) has been reduced to less than 15mm by market requirements, among which, except for the thickness of the CPU + motherboard + heat dissipation module, the battery life must be increased. The thickness of the battery must also be reduced, and the mechanical hard disk is also replaced by a solid-state semiconductor hard disk to reduce thickness. This has created a great challenge for notebook developers. After the system and mechanism are thinned, the thickness of the heat dissipation module is also thinned, and the CPU will not work. The generated heat still has to be dissipated quickly, which poses a particularly great challenge. For this reason, the deve...
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IPC IPC(8): G06F1/20
Inventor 郭昭正
Owner SY THERMAL