led packaging method

Abstract

The invention is applied to the field of LED packaging technologies and provides an LED packaging method. The LED packaging method includes the steps of etching a plurality of etching grooves parallel to one another in a metal etching piece, welding the positive electrode and the negative electrode of an LED flip-chip wafer onto the two sides of the upper portion of each etching groove, coating fluorescence gel on the metal etching piece and enabling the fluorescence gel to be solidified, wherein the LED flip-chip wafer is covered with the fluorescence gel, bonding adhesive tape to the lower surface of the metal etching piece, forming transparent packaging gel on the metal etching piece, where the fluorescence gel is covered with the transparent packaging gel, filling the transparent packaging gel into the etching grooves, enabling the transparent packaging gel to be solidified, and finally removing edges of the metal etching piece and the adhesive tape and cutting out LEDs. According to the LEDs packaged in the method, the metal etching piece serving as the positive electrodes and the negative electrodes of the LEDs exist between the wafer electrodes to welding electrodes of application ends and play a role of transition, so the use difficulty of the LEDs at the application ends can not be increased, and the use of the LEDs is completely the same as the use of a support formed through injection molding.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, in particular to an LED packaging method. Background technique [0002] The packaging method of white light LED products is to fix the LED chip on the bracket by bonding or eutectic welding, use gold wires to connect the positive pole of the chip to the positive pole of the bracket, and connect the negative pole of the chip to the negative pole of the bracket, and then Fill with phosphors that match the target color zone. Due to the different thermal expansion coefficients of brackets and wafer colloids, reliability problems are prone to occur in brackets, die-bonding glue, gold wires, colloids, etc., and there are many types of LED brackets. The materials for bonding the positive and negative electrodes of the bracket are PPA, PCT, and EMC. , in terms of high temperature resistance and air tightness, there are relatively large defects, which affect the reliability of LED products; ceramic...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide an LED packaging method, which aims to solve the problem of low reliability of the LED produced by the existing packaging method

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