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Flat heat pipe and manufacturing method thereof

A technology for flat heat pipes and manufacturing methods, which is applied in the direction of indirect heat exchangers, lighting and heating equipment, and structural components of electrical equipment, etc., which can solve the problems of poor heat conduction performance of flat heat pipes and achieve good heat conduction performance

Inactive Publication Date: 2014-06-18
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the flat heat pipe is in use, the vapor space is restricted by the capillary structure, which leads to poor heat conduction performance of the flat heat pipe

Method used

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  • Flat heat pipe and manufacturing method thereof
  • Flat heat pipe and manufacturing method thereof
  • Flat heat pipe and manufacturing method thereof

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Experimental program
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Embodiment Construction

[0026] Please also see Figure 1 to Figure 4 , the manufacturing method of the flat heat pipe of the first embodiment of the present invention comprises the following steps:

[0027] Step 1: providing a hollow longitudinal tube 10 with a uniform wall thickness;

[0028] Step 2: providing a rod body 12, the rod body 12 is made of high temperature resistant material. According to the needs of use, the rod body 12 can be subjected to high-temperature surface treatment in a nitrogen environment in advance to make the surface layer of the rod body 12 nitriding, and then an organic release agent is sprayed on the surface of the rod body 12 . See figure 1 , the rod body 12 is a lengthwise rod body. The cross-section of the rod body 12 is substantially circular, and the outer diameter of the rod body 12 corresponds to the inner diameter of the round tube 10 . A first groove 120 and a second groove 122 extending along the longitudinal direction of the rod body 12 are defined on the...

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PUM

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Abstract

A flat heat pipe comprises a longitudinal hollow flat pipe body, a first capillary structure, a second capillary structure and a working medium accommodated in the pipe body, wherein the first capillary structure and the second capillary structure are arranged on the inner wall face of the pipe body in the longitudinal length direction of the pipe body, the inner wall face of the pipe body comprises a bottom wall face and a top wall face which are vertically opposite, the first capillary structure is formed on the bottom wall face of the pipe body, the second capillary structure is formed on the top wall face of the pipe body, the outer surface of the first capillary structure adheres to the outer surface of the second capillary structure, and a steam space is formed in a region outside the first capillary structure and the second capillary structure in the flat heat pipe. Compared with the prior art, the flat heat pipe has good heat conducting performance and is suitable for an electronic device with a narrow internal space, such as a notebook computer. The invention further provides a manufacturing method of the flat heat pipe.

Description

technical field [0001] The invention relates to a flat heat pipe and a manufacturing method thereof, in particular to a flat heat pipe used in the field of heat dissipation of electronic components and a manufacturing method thereof. Background technique [0002] At present, flat heat pipes have been widely used in electronic components with large heat generation due to their advantages of high heat transfer. Existing flat heat pipes generally include a hollow closed tube body, a capillary structure arranged in the tube body and a working medium filled in the tube body. When the flat heat pipe is working, the low-boiling-point working medium filled in the pipe body absorbs the heat generated by the heating electronic components in the evaporation part and then evaporates and vaporizes. The steam moves to the condensation part with heat and releases the heat by liquefaction and condensation , thereby dissipating heat from electronic components. The liquefied working medium ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCH05K7/20336H01L23/427H01L2924/0002F28D15/0233F28D15/046Y10T29/49353H01L2924/00
Inventor 代升亮吴佳鸿
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD