Glue coating crystal solidifying equipment

Abstract

The invention discloses glue coating crystal solidifying equipment, which comprises a wafer disc, a glue disc, a carrier and a crystal solidifying arm, wherein the wafer disc is used for placing crystal grains requiring the crystal solidification, the glue disc is used for carrying out gluing treatment on glue water coated on the bottoms of crystal grains, the carrier is used for providing the positions requiring the crystal solidification of the crystal grains, the crystal solidifying arm is used for picking the crystal grains, the crystal grains are conveyed to a glue disc station to be subjected to gluing treatment through the crystal solidifying arm, and then, the crystal grains subjected to the gluing treatment are bonded and welded on the positions requiring the crystal solidification on the carrier through the crystal solidifying arm. The single mechanical arm is adopted for completing the whole technical process (including crystal picking, glue taking and crystal solidifying), the problems of time sequence and structural space of the traditional process are solved, a mode for increasing work units is adopted, the equipment capacity is greatly improved, and meanwhile, the glue coating crystal solidifying equipment mainly solves the problems that in the traditional process, the height-diameter ratio in each time of glue discharge is low, the point gluing precision and the crystal solidifying precision are mutually influenced, the consistency of the shape, the thickness and the size of glue points is poor, the thickness is difficult to control, and the blind point or poor firmness and the like of the bonding surfaces can be caused.

Description

technical field [0001] The invention relates to the field of semiconductor precision manufacturing and equipment, in particular to a glue-covered die-bonding equipment for IC and LED semiconductor packaging. Background technique [0002] Die bonder (or chip bonder) is a high-precision automatic packaging equipment that bonds chips and carriers to form thermal or electrical paths. In view of the limitations of the traditional die-bonding process, the current international leading semiconductor packaging manufacturers still use the traditional glue dispensing and die-bonding mechanism to execute the process successively to bond the chip to the target area, so that a thermal path or an electrical path is formed between the chip and the carrier. Therefore, equipment packaging manufacturers also continuously improve the structure, control, and drive of the die-bonding equipment based on this process. However, after years of hard work, the speed of the die-bonding equipment based ...

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a glue-covered die-bonding equipment, which uses a single mechanical arm to complete a process (including picking up crystals, taking glue and die-bonding), which solves the traditional process timing and structural space. The problem is to increase the production capacity of the equipment by increasing the number of working units. At the same time, the most important thing is to solve the problem of the height-to-diameter ratio of each glue output in the traditional process, the interactive influence of dispensing accuracy and die-fixing accuracy, and the glue’s fastness and shape are not good. Control and other issues

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