A kind of vinyl ester resin and preparation method thereof

Abstract

The invention relates to a high temperature-resistant thickening vinyl ester resin, which is prepared by: subjecting 40%-50% of epoxy resin, 10%-20% of unsaturated monocarboxylic acid, 2%-6% of unsaturated polycarboxylic acid or poly-anhydride, and 0.03%-0.1% of a polymerization inhibitor to reaction for 2-6h at 85DEG C-120DEG C in the presence of 0.1-0.3% of a catalyst, and then dissolving the reaction product in 30%-40% of a crosslinkable monomer. The resin provided by the invention has excellent high temperature resistance and thickening effect, and the SMC board prepared from the resin has excellent heat resistance and good impact resistance.

Description

technical field [0001] The invention relates to a vinyl ester resin and a preparation method thereof, in particular to a high temperature resistant thickening vinyl ester resin. Background technique [0002] At present, vinyl ester resins are produced by manufacturers at home and abroad, but their high temperature resistance is limited, and there are almost no products that can withstand high temperatures of 150°C for a long time. Moreover, the high temperature resistant vinyl ester resins currently on the market have poor thickening properties and are not suitable for SMC / BMC processes. The current high-temperature-resistant vinyl ester resin is only suitable for hand lay-up / spray molding process, and it is difficult to popularize and apply it in SMC / BMC and other compression molding processes [0003] The vinyl ester resin introduced in U.S. Patent US4480077 is a product synthesized by bisphenol A, bisphenol A epoxy resin, and methacrylic acid under the catalysis of a qua...

AI Technical Summary

Problems solved by technology

At present, there are a small number of ordinary vinyl resins on the market that can meet the requirements of SMC and BMC molding processes. Due to their poor thickening performance, high temperature resistant vinyl resins are difficult to use in this molding process.

[0006] The name of the invention is rapid thickening vinyl ester resin and its preparation method and use, and the patent application number is CN200910200365.8 Chinese patent application discloses a fast thickening epoxy vinyl ester resin and its preparation method and use. The resin adopts bisphenol A type epoxy resin 1000, but bisphenol A epoxy resin has only two epoxy bonds in the molecular chain, and the crosslinking density of the product is low; Although the thickening accelerator improves the thickening effect, it reduces other properties of the vinyl resin, especially the heat resistance effect is poor

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