Through-silicon via patch board testing method
A test method and adapter board technology, which is applied in the direction of the measuring device casing, etc., can solve the problems affecting the electrical test efficiency and test effect of the through-silicon via adapter board, affecting the packaging quality, scratches on the through-silicon via adapter board, etc.
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[0016] The invention will be described in detail below in conjunction with the accompanying drawings, but this embodiment is not limited to the present invention, and the structural, method or functional transformations made by those of ordinary skill in the art according to this embodiment are included in the scope of the present invention. within the scope of protection.
[0017] A method for testing a TSV adapter plate, comprising the following steps:
[0018] See figure 2 , (1), preparation of the test adapter board, prepare a pad 2 on the test adapter board 1, and use the probe lead 3 to lead the pad to the other side of the test adapter board 1;
[0019] See image 3 , (2), using a temporary soldering method to physically connect the bumps 5 (solder balls) on the TSV adapter board 4 to the test adapter board 1;
[0020] See Figure 4 , (3), the test adapter board 1 is installed on both sides of the TSV adapter board 4, and the pressure soldering point (pad ) 2 is l...
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