Temperature fuse and sliding electrode used in temperature fuse

一种温度熔断器、电极的技术，应用在电路、电开关、电气元件等方向，能够解决剥离、起不到温度熔断器、镀敷与母材料密接性差等问题

Inactive Publication Date: 2014-07-23
NEC SCHOTT COMPONENTS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the extremely thin silver-plated film is easily damaged by the arc generated during the separation operation. In this case, the surface of the copper material is exposed and the contact is melted, so the melting of the contact cannot be sufficiently prevented.
If the contact point melts, the current will not be cut off, so it will not function as a thermal fuse
In addition, the adhesion between the plating and the base material is poor, and problems such as peeling may occur

Method used

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  • Temperature fuse and sliding electrode used in temperature fuse
  • Temperature fuse and sliding electrode used in temperature fuse
  • Temperature fuse and sliding electrode used in temperature fuse

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0037] image 3 (a) is a plan view showing the sliding electrode 10 according to Embodiment 1, image 3 (b) is its side view. The slide electrode 10 has a circular central region 11 and a plurality of claws 12 extending outward from the central region 11 . The claws 12 have a shape in which a surface 12 a of the claw is curved inward. The sliding electrode 10 is arranged in the thermal fuse so that the outer surface 12b of the claw portion 12 is in contact with the inner surface of the metal case, and the inner surface 11a of the central region 91 is in contact with the terminal.

[0038] Sliding electrode 10 is formed by processing a thin metal plate. Sliding electrode 10 includes a base layer made of copper or copper alloy, and a first surface layer made of silver or silver alloy, and the contact portion with the terminal, that is, surface 11a inside central region 11 becomes the first surface layer. The processing method of the metal thin plate is not particularly limite...

Embodiment approach 2

[0045] The slide electrode according to Embodiment 2 has the same structure as the slide electrode according to Embodiment 1 except that the laminated structure is different. Figure 5 is a cross-sectional view showing the center region of the slide electrode according to the second embodiment. Figure 5 The laminated structure 30 shown has the base material layer 21 and the 1st surface layer 22 similarly to Embodiment 1, and also has the 2nd surface layer 31 laminated|stacked on the side opposite to the 1st surface layer 22 of the base material layer 21. The second surface layer 31 is preferably a layer composed of silver or a silver alloy. The second surface layer 31 also has the protection performance of the sliding electrode as the first surface layer 22 . As silver or a silver alloy, the same material as that exemplified for the first surface layer 22 can be used, but it is not necessarily the same as the material of the first surface layer 22 .

[0046] In addition, si...

Embodiment approach 3

[0048] The slide electrode according to Embodiment 3 has the same structure as the slide electrode according to Embodiment 2 except that the laminated structure is different. Figure 6 A cross-sectional view of a central region of a slide electrode according to Embodiment 3 is shown. Figure 6 The laminated structure 40 shown has a structure in which the first surface layer 22 and the second surface layer 31 are respectively laminated on both surfaces of the base material layer 21 as in the second embodiment, and the base layer 21 and the second surface layer are further laminated. Nickel layers 41 and 42 are provided between the first surface layer 22 and between the base material layer 21 and the second surface layer 31 . Diffusion of copper from the base material layer 31 can be prevented by the nickel layers 41 and 42 . The nickel layers 41 and 42 can be formed by methods such as electrolytic plating, electroless plating, and electroplating. The thickness of the nickel l...

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PUM

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Abstract

The present invention provides a temperature fuse (70, 80) provided with a cylindrical metal case (76), a sliding electrode (10) that can slide on the inner surface of the metal case (76), and a terminal (71, 78) that is electrically connected to the metal case (76) while in contact with the sliding electrode (10). When the temperature fuse operates, the sliding electrode (10) separates from the terminal (71, 78) and the electrical connection between the terminal (71, 78) and the metal case (76) is broken. The sliding electrode (10) is formed by processing a thin metal plate and is provided with at least a base material layer (21) made of copper or a copper alloy and a first surface layer (22) made of silver or a silver alloy. The thickness of the first surface layer (22) is 5 mum or greater at the location where contact is made with the terminals (71, 78).

Description

technical field [0001] The present invention relates to a thermal fuse and a sliding electrode used in the thermal fuse. Background technique [0002] Traditionally, thermal fuses have been used to protect household or industrial electronic and electrical equipment from overheating damage. As a protective component that accurately senses the temperature of the device and cuts off the circuit quickly when it is abnormally overheated, the thermal fuse is used in various home appliances, mobile devices, communication equipment, office equipment, car equipment, AC adapters, chargers, motors , batteries, and other electronic components. Generally, thermal fuses have a wide range of nominal rated current from 0.5A to 15A. However, especially when used for high currents above 6A, it is preferable to use thermal fuses that have contacts and separate the contacts when abnormal temperatures are sensed. Sensitive granular temperature fuse. [0003] There are various types of h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H37/76H01H1/025H01H1/04
CPCH01H37/765H01H1/025H01H1/04H01H1/36H01H85/36
Inventor 吉川时弘
Owner NEC SCHOTT COMPONENTS CORP
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