Low-temperature matching co-firing method of non-magnetic materials and nicuzn ferrite materials

Abstract

The invention is applicable to the technology field of production and manufacturing of electronic components, and discloses a low-temperature matching cofired method of a non-magnetic material and an NiCuZn ferrite material. The method comprises the following steps: step 1, preparing the NiCuZn ferrite material, and preparing the non-magnetic material having the same spinel structure as the NiCuZn ferrite; and step 2, carrying out an LTCC sintering process on the NiCuZn ferrite material and the non-magnetic material, and carrying out tape casting, wet-process molding, printing, isostatic pressing, cutting, glue discharging, sintering, silver coating and electroplating processes to obtained the required electronic components. Under a condition without introducing a third material or changing a slurry formula, matching cofiring of the heterogeneous materials is realized; at the same time, the non-magnetic material has little influence on electromagnetic properties of the ferrite material, and can be used as an effective air-gap layer material. The method has the characteristics of simpleness and convenience, good operability, low price, remarkable effects and the like, and can be widely applied in manufacturing of various electronic components in the LTCC technology.

Description

technical field [0001] The invention belongs to the technical field of production and manufacture of electronic components, and in particular relates to a low-temperature matching co-firing method of a non-magnetic material and a NiCuZn ferrite material. Background technique [0002] LTCC (low temperature co-fire ceramics, low temperature co-fired ceramics) technology is a new technology of chip devices and integrated components that has emerged in recent years. It is made of low-temperature sintered (generally below 900°C) ceramic or ferrite powder by tape casting to make a thick film strip, and then sintered at 900°C after molding, printing, isostatic pressing, and cutting. Finally, after capping and electroplating, high-density electronic devices that do not interfere with each other in three-dimensional space are made. Because LTCC technology can provide excellent component accuracy, high-density three-dimensional multilayer wiring and chip integration of passive compon...

AI Technical Summary

Problems solved by technology

[0004] The above methods, 1 and 2 cannot fundamentally solve the impact of sintering mismatch, and at the same time, due to the introduction of intermediate layer or buffer layer materials, it also has an unpredictable impact on the performance of electronic devices

The third method has a good effect on solving the mismatch phenomenon, but it also adds co-firing additives, which complicates the manufacturing process and increases the production cost

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