Method for manufacturing wound type thin-film capacitor

Abstract

The invention relates to a method for manufacturing a wound type thin-film capacitor. The method for manufacturing the wound type thin-film capacitor comprises the winding process, the pre-stamping process and the stamping process. In the winding process, raw materials of the capacitor are wound into a round capacitor core, wherein the middle of the round capacitor core is provided with a roll center portion; in the pre-stamping process, two parallel end faces are extruded from the circumferential surface of the round capacitor core formed in the winding process, and the round capacitor core is pre-pressed to form a flat capacitor core which is not prone to rolling; in the stamping process, pressure is exerted on the two parallel end faces of the flat capacitor core formed in the pre-stamping process, and the distance between the two parallel end faces is reduced. The method for manufacturing the wound type thin-film capacitor has the advantage that pre-stamping is conducted before the stamping process, so that the problem that because the center states of original capacitor components are arbitrary during stamping in the prior art, cracks will be formed in the centers of stamped wound type capacitors is solved.

Description

technical field [0001] The invention relates to a manufacturing method of a winding capacitor, in particular to a manufacturing method of a winding film capacitor. Background technique [0002] In the prior art, when manufacturing film capacitors, the first step: element winding process; the second step: forming stamping process and other processes are carried out separately. In this case, since the circular capacitor core produced in the element winding process needs to be rearranged in the forming stamping process, while the core portion of the circular capacitor core (such as figure 1 As shown, the winding core is S-shaped in the center of the circular capacitor core. In the prior art, each capacitor core is circular, and it is difficult to place the winding core on the stamping device at the same angle) to Different angles are placed on the stamping device (as follows figure 1 ), it takes a lot of time to arrange the circular capacitor cores, and the central state of t...

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a manufacturing method of wound-type film capacitors, which solves the problem that in the prior art, the central state of the capacitor original is very random during stamping and forming, so that cracks will appear in the center of the stamped and formed winding-type capacitors technical issues

[0005] The beneficial effect of the present invention is: by performing pre-stamping before the stamping process, the central state of the capacitor original is very random during stamping in the prior art, so that the center of the stamped winding capacitor will have cracks. Technical problem

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