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A Substrate Integrated Waveguide Filter Using Microstrip Lines to Realize Cross-Coupling

A substrate-integrated waveguide and cross-coupling technology, which is applied in the field of wireless communication, can solve problems such as complex adjustments, and achieve good performance, improved in-band performance, and good matching effects

Inactive Publication Date: 2016-04-13
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The above four substrate integrated waveguide filters are all based on magnetic field coupling to realize electric field coupling and cross coupling, and the magnetic field coupling is adjusted through the inductance window between adjacent cavities. When the magnetic field coupling changes relatively large, Adjusting through the inductance window can get quite complicated

Method used

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  • A Substrate Integrated Waveguide Filter Using Microstrip Lines to Realize Cross-Coupling
  • A Substrate Integrated Waveguide Filter Using Microstrip Lines to Realize Cross-Coupling
  • A Substrate Integrated Waveguide Filter Using Microstrip Lines to Realize Cross-Coupling

Examples

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Embodiment 1

[0059] Such as Figure 5 , Figure 6 and Figure 7 As shown, the substrate integrated waveguide filter of this embodiment includes a first dielectric plate 1, a second dielectric plate 2, a first metal sheet 3, a second metal sheet 4 and upper and lower two plates constituting a substrate integrated waveguide (SIW). Rows of metal through holes 5 are arranged in sequence from the bottom to the top in the order of the first metal sheet 3, the first dielectric plate 1, the second metal sheet 4 and the second dielectric plate 2, the first metal sheet 3 is used as the floor, and the The upper and lower rows of metal through-holes 5 constitute the side wall of the waveguide, and pass through the first metal sheet 3, the first dielectric plate 1, and the second metal sheet 4 in sequence, wherein the upper row of metal through-holes 5 is set close to the first metal sheet 3 and the upper edge of the second metal sheet 4, the lower row of metal through holes 5 are arranged near the l...

Embodiment 2

[0075] The main features of this embodiment are: as Figure 17 As shown, the first branch 15, the second branch 16, the third branch 17 and the fourth branch 18 are all branches of 1 / 2λg. All the other structures are with embodiment 1.

[0076] The substrate integrated waveguide filter of this embodiment is loaded with 1 / 2λg stubs at both ends of the microstrip line, and the electromagnetic wave propagation characteristics of the loaded 1 / 2λg stubs are as follows Figure 18 As shown, the solid line arrow in the figure indicates the incident wave, and the dotted line arrow indicates the reflected wave. There is a 360-degree phase delay during electromagnetic wave propagation, and the sign of the cross-coupling generated is positive, which is just the opposite of Example 1. It can be seen that the length of the branch Different, the resulting cross-coupling characteristics are not the same.

[0077] The topological structure of the substrate integrated waveguide filter in this...

Embodiment 3

[0081] The main features of this embodiment are: as Figure 23 As shown, the first branch 15 and the fourth branch 18 are both branches of 1 / 4λg, and the second branch 16 and the third branch 17 are both branches of 1 / 2λg. All the other structures are with embodiment 1.

[0082] In the substrate integrated waveguide filter of this embodiment, 1 / 4λg stubs are loaded at one end of the microstrip line, and 1 / 2λg stubs are loaded at the other end, and the electromagnetic wave propagation characteristics of the loaded 1 / 4λg stubs and 1 / 2λg stubs are as follows Figure 24 As shown, the solid line arrow in the figure indicates the incident wave, and the dotted line arrow indicates the reflected wave. When the electromagnetic wave propagates, there will be a phase difference of 180 degrees. This structure will generate an additional zero point.

[0083] The topological structure of the substrate integrated waveguide filter in this embodiment is as follows Figure 25 As shown, the so...

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Abstract

The invention discloses a substrate integrated waveguide filter utilizing microstrip lines for achieving cross coupling. The substrate integrated waveguide filter comprises a first dielectric slab, a second dielectric slab, a first metal sheet, a second metal sheet, an upper row of metal through holes and a lower row of metal through holes. The upper row of metal through holes and the lower row of metal through holes penetrate through the first metal sheet, the first dielectric slab and the second metal sheet in sequence. A first groove line, a second groove line, a third groove line, a fourth groove line and a fifth groove line are formed in the second metal sheet from left to right in sequence, and a first resonator, a second resonator, a third resonator and a fourth resonator are formed between the adjacent groove lines. A first metal microstrip line and a second metal microstrip line are arranged on the front face of the second dielectric slab, and the two ends of the first metal microstrip line and the two ends of the second microstrip line are loaded with branch knots respectively. The substrate integrated waveguide filter has the advantages of being simple in structure and good in performance, electric field coupling is achieved through the groove lines, cross coupling is achieved through the microstrip lines on the basis of electric field coupling, and the requirement of a modern communication system can be met well.

Description

technical field [0001] The invention relates to a substrate-integrated waveguide filter, in particular to a substrate-integrated waveguide filter which utilizes microstrip lines to realize cross-coupling, and belongs to the field of wireless communication. Background technique [0002] Wireless communication technology is playing an increasingly important role in real social life. As an important component in the field of wireless communication, the demand for band-pass filters is also increasing. The earlier microstrip bandpass filter was widely used due to its convenience in plan drawing and board making, but this kind of filter has a large loss, especially at high frequencies, it will produce a lot of energy radiation. With the continuous development of communication technology, the requirements for filters are getting higher and higher. Although the millimeter-wave filter using metal waveguide can achieve better technical indicators, it is expensive and cannot be widely...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/20H01P1/203
Inventor 王世伟陈瑞森汪凯郭在成林景裕褚庆昕
Owner SOUTH CHINA UNIV OF TECH
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