Electronic package and fabrication method thereof
A technology for electronic packaging and electronic components, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of unfavorable packaging technology, difficulty in reducing the width of wireless communication module 1, and difficulty in reducing the width of substrate 10
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[0034] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
[0035] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "two" and "one" quote...
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