Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Electronic package and fabrication method thereof

A technology for electronic packaging and electronic components, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of unfavorable packaging technology, difficulty in reducing the width of wireless communication module 1, and difficulty in reducing the width of substrate 10

Active Publication Date: 2014-08-06
SILICONWARE PRECISION IND CO LTD
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing wireless communication module 1, the antenna structure 12 is planar, so based on the electromagnetic radiation characteristics between the antenna structure 12 and the electronic component 11 and the volume limitation of the antenna structure 12, in the process, the The antenna body 120 is difficult to be integrated with the electronic component 11, that is, the packaging material 13 only covers the electronic component 11 and does not cover the antenna body 120, so that the mold of the packaging process needs to correspond to the layout area of ​​these electronic components 11, and Does not correspond to the size of the substrate 10, which is not conducive to the packaging process
[0005] In addition, because the antenna structure 12 is planar, it is necessary to increase the layout area (the area where the encapsulation material 13 is not formed) on the surface of the substrate 10 to form the antenna body 120, which makes it difficult to reduce the width of the substrate 10, so it is difficult to Reduce the width of the wireless communication module 1, so that the wireless communication module 1 cannot meet the miniaturization requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic package and fabrication method thereof
  • Electronic package and fabrication method thereof
  • Electronic package and fabrication method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0035] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "two" and "one" quote...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an electronic package and a fabrication method thereof. The electronic package is provided with a substrate, electronic components disposed on the substrate; an antenna structure disposed on the substrate, and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. The antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate without increasing disposing area or width of the substrate, thereby meeting the miniaturization requirements of the electronic package.

Description

technical field [0001] The invention relates to an electronic package, especially an electronic package with an antenna structure. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. At present, wireless communication technology has been widely used in various consumer electronic products to receive or transmit various wireless signals. In order to meet the appearance design requirements of consumer electronic products, the manufacture and design of wireless communication modules are developed towards light, thin, short, and small requirements. Among them, the planar antenna (Patch Antenna) is small in size, light in weight, and easy to manufacture. It is widely used in wireless communication modules of electronic products such as mobile phones (cell phone) and personal digital assistants (Personal Digital Assistant, PDA). [0003] figure ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/22H01Q1/36H01Q1/48H01Q1/50
CPCH01Q1/2283H01Q1/24Y10T29/49016H01L2223/6677H01L2224/48227H01L2924/19105H01L23/552H01Q1/52H01Q1/526
Inventor 邱志贤朱恒正林建成蔡宗贤杨超雅
Owner SILICONWARE PRECISION IND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products