Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic equipment, electronic system and circuit board interconnecting architecture

An electronic system and circuit board technology, which is applied in the structural connection of printed circuits, circuits, printed circuits connected with non-printed electrical components, etc., can solve problems such as large assembly tolerances and circuit board deformation

Active Publication Date: 2014-08-06
HUAWEI TECH CO LTD
View PDF6 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the front plug-in circuit board and the rear plug-in circuit board are directly plugged and connected, there will be a large assembly tolerance between the two, and the accumulated tolerance chain may exceed the requirements for the matching accuracy of the connector, resulting in the assembly of the connector of the circuit boards are deformed after the mating connection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic equipment, electronic system and circuit board interconnecting architecture
  • Electronic equipment, electronic system and circuit board interconnecting architecture
  • Electronic equipment, electronic system and circuit board interconnecting architecture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] see figure 1 and figure 2 , an electronic system 1 provided by a preferred embodiment of the present invention can be applied to electronic equipment such as servers, routers, and switches (not shown in the figure), and is packaged as a circuit with specific functions in the casing of the electronic equipment as a whole. The electronic system 1 includes at least one first board 10, at least two second boards 20, a plurality of first signal connectors ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed is a circuit board interconnection architecture, which comprises at least one first plugboard and at least two second plugboards which are roughly perpendicular to the first plugboard. At least one of the first plugboard and the second plugboards is provided with several notches, the first plugboard and the second plugboards are inserted and coupled with each other, and are electrically connected, by means of a signal connector mounted on both sides of the notches. The circuit board interconnection structure solves the problem of coupling accuracy in the orthogonal direction of the first plugboard and the second plugboards. Even if an assembly tolerance exists between the first plugboard and the second plugboard, the connector still meets the requirement of assembly accuracy, and can prevent the overall deformation of a first circuit board and a second circuit board after the first plugboard and the second plugboards are orthogonally interconnected and abutted. Also provided are an electronic system and an electronic device using the electronic system.

Description

technical field [0001] The invention relates to the field of electronic circuits, in particular to an electronic device, an electronic system and a circuit board interconnection structure thereof. Background technique [0002] At present, the electronic systems of electronic equipment such as servers, routers, and switches are usually composed of a number of interconnected and interacting basic circuits with specific functions. Most of the functional circuits are deployed and integrated on circuit boards. Connectors are used to realize the electrical connection between the various functional circuits. Most of the circuit boards of existing electronic equipment adopt the layout arrangement of the orthogonal structure, that is, the connectors on the front plug-in circuit board and the rear plug-in circuit board of the electronic system are directly orthogonal and vertically inserted, so as to realize the layout of the circuit board. The electrical connection of each functiona...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/18H01R13/631
CPCH05K1/11H01R12/722H01R12/737H05K1/14H05K3/366H05K2201/044H05K2201/09063H05K2201/09163H05K2201/10189
Inventor 白磊刘雄彪彭乐雄
Owner HUAWEI TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com