Air-cooling radiator and manufacturing method thereof

A manufacturing method and radiator technology, applied in the direction of cooling/ventilation/heating transformation, can solve the problems of affecting the heat dissipation effect of the radiator and increasing the contact thermal resistance, so as to achieve the improvement of the heat dissipation effect, the improvement of the heat dissipation effect, and the centralized and balanced air volume. Effect

Inactive Publication Date: 2014-08-13
深圳市华盛源机电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] like figure 1 , 2 As shown, the existing air-cooled radiator includes a base plate 7 and a heat sink 8 plugged on the base plate 7, and since there is a certain air gap between the connection end of the heat sink 8 and the base plate 7, the heat from the base plate 7 The contact thermal resistance on the conduction path increases, which seriously affects the heat dissipation effect of the radiator

Method used

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  • Air-cooling radiator and manufacturing method thereof
  • Air-cooling radiator and manufacturing method thereof
  • Air-cooling radiator and manufacturing method thereof

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Embodiment Construction

[0031] In the following, the present invention will be further described in conjunction with the accompanying drawings and specific embodiments, so as to understand the technical ideas claimed in the present invention more clearly.

[0032] Such as image 3 , 4 , 5, it is an air-cooled radiator of the present invention, including a heat conduction substrate 1 and a heat sink 2; the heat conduction substrate 1 is provided with a slot 11, and the connection end of the heat dissipation fin 2 is fixed on the heat conduction The slots 11 of the substrate 1 and between the connecting end of the heat sink 2 and the slots 11 are filled with a heat conduction medium 4 ; the heat sink 2 is also formed with an air passage 21 .

[0033] During use, the heat conduction substrate 1 absorbs the heat of the heating element and conducts it to the heat sink 2, and the heat conduction medium 4 can reduce the thermal resistance between the heat conduction substrate 1 and the heat dissipation fin...

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Abstract

The invention discloses an air-cooling radiator and a manufacturing method thereof. The air-cooling radiator comprises a thermal conduction substrate and cooling fins. Fin insertion grooves are formed in the thermal conduction substrate. A connecting end of each cooling fin is fixed in the corresponding fin insertion groove in the thermal conduction substrate. The space between the connecting end of each cooling fin and the corresponding fin insertion groove is filled with a thermal conduction medium. An air passing passageway is further formed in each cooling fin. The space between the connecting end of each cooling fin and the corresponding fin insertion groove is further filled with the corresponding thermal conduction medium, thermal resistance between the thermal conduction substrate and the cooling fins can be reduced through the thermal conduction mediums, thermal conduction is facilitated, and the heat dissipation effect of the air-cooling radiator is improved; the cooling fins can be more tightly attached to the side walls of the fin insertion grooves, and therefore thermal resistance can be further reduced; by the adoption of the design of the air passing passageways, air from an external fan can flow through the space outside the cooling fins and the air passing passageways, so that the inner portion and the outer portion of the cooling fins are fully cooled, and heat on the cooling fins can be rapidly taken away.

Description

[0001] technical field [0002] The invention relates to an air-cooled radiator and a manufacturing method thereof. Background technique [0003] With the continuous improvement of the reliability, performance index and power output requirements of electronic equipment, the heat dissipation requirements of electronic equipment also need to be increased accordingly. As an important heat dissipation component in electronic equipment, the radiator is mainly used to dissipate the heat generated by the heating element into the surrounding air to ensure that the heating object can work normally. As a common radiator, air-cooled radiators usually cooperate with cold air and use the cooling fins on the radiator to dissipate heat. Therefore, the cooling fins with good performance can give full play to the wind force, thereby achieving a good cooling effect. [0004] Such as figure 1 , 2 As shown, the existing air-cooled radiator includes a base plate 7 and a heat sink 8 plugged on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 刘希望梁金伟
Owner 深圳市华盛源机电有限公司
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