A device for uniformly baking a
photoresist film on the surface of a large-
caliber substrate, the device mainly includes a baking
system, a substrate loading and unloading
system and a
control system. The baking
system is mainly composed of a circulating fan, a
heating element, a high-efficiency filter, a baking chamber, a chamber sealing ring, a wind guide plate, an air inlet port, a return air port and a circulating air duct, a gas input port and an exhaust port. It has a cleanliness level of 100, a
temperature control range of 20°C to 200°C, a chamber temperature uniformity better than ±3°C, and a temperature accuracy of ±0.5°C. The substrate loading and unloading system includes a transfer trolley and a substrate lifting device. The transfer trolley has a function of adjusting the substrate tilt at a small angle, and a guide plate is provided on the side close to the substrate near the air inlet end, which can ensure that the large-
caliber sample is safely baked up and down the chamber
station, and can also optimize the film baking process. The device of the present invention can realize the
photoresist film baking process of a two-way meter-level size and ultra-thick substrate, and further improve its film thickness uniformity on the basis of the uniformity of the
photoresist film thickness after
coating.