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Coating apparatus and coating method

A coating device and coating technology, applied in the direction of the surface coating liquid device, spray device, liquid spray device, etc., can solve the problems of not considering the temperature adjustment of the forming air, the inability to obtain a coating film, etc., and achieve good coating cloth effect

Inactive Publication Date: 2014-08-27
TOKYO OHKA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, in the above-mentioned prior art, the temperature adjustment of the molding air is not taken into account, and for example, when the processing temperature of the substrate is high, there may be a phenomenon that a good coating film cannot be obtained.

Method used

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  • Coating apparatus and coating method
  • Coating apparatus and coating method

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Embodiment Construction

[0036] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0037] figure 1 It is a figure which shows the structure of the coating apparatus CTR concerning this embodiment.

[0038] Such as figure 1 As shown, the coating device CTR has a substrate storage device ACM and a coating nozzle CNZ. The coating device CTR is a device that applies a coating liquid to the substrate S accommodated in the substrate storage device ACM using the coating nozzle CNZ. The coating device CTR is used on the floor parallel to the horizontal plane. As the coating nozzle CNZ, for example, a rotary atomizing nozzle is used.

[0039] In this embodiment, as the substrate S, a plate-shaped member made of, for example, glass, resin, or the like is used. In addition, as the substrate S, a wafer can also be used. In this embodiment, molybdenum is also formed on the substrate S by sputtering as a back electrode. Obviously, other conductive substances...

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Abstract

A coating apparatus including a coating nozzle configured to apply a coating liquid to a substrate, and a gas supply part configured to supply a temperature control gas which controls an ejection direction of the coating liquid to the substrate.

Description

technical field [0001] The invention relates to a coating device and a coating method. [0002] This application claims priority based on Japanese Patent Application No. 2013-034836 for which it applied in Japan on February 25, 2013, and uses the content for this application. Background technique [0003] As a rotary atomization coating method, there is known a method of supplying temperature-regulated air around the molding air to eliminate the temperature difference between the air and the molding air to prevent generation of turbulence (for example, refer to Patent Document 1). [0004] 【Prior technical literature】 [0005] 【Patent Literature】 [0006] Patent Document 1: Japanese Patent Application Laid-Open No. 9-225350 [0007] However, in the above-mentioned prior art, the temperature adjustment of the molding air is not taken into account, and for example, when the processing temperature of the substrate is high, there may be a phenomenon that a good coating film c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B5/04B05D1/04
CPCB05B3/1014B05B9/002B05B3/1092B05B3/1064B05B3/0409Y02E10/541B05D1/02B05B7/1626B05B3/1035
Inventor 岛井太佐藤晶彦丸山健治细田浩千叶正树
Owner TOKYO OHKA KOGYO CO LTD
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