Electrochemical polishing apparatus and method thereof

A polishing device and electrochemical technology, applied in the direction of electrolysis process, electrolysis components, etc., can solve the problems of complex baseband method, slow baseband polishing processing speed, unreasonable method, etc.

CN104032366AActive Publication Date: 2014-09-10SUZHOU NEW MATERIAL INST +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2014-09-10

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Abstract

The invention discloses an electrochemical polishing apparatus. The apparatus comprises: a tank body; at least one electrolytic cell horizontally penetrating through the tank body, wherein the electrolytic cell forms an inlet and an outlet at two ends of the tank body respectively, and a workpiece to be polished transversely moves in the electrolytic cell; electrodes positioned at two sides of the electrolytic cell, wherein an electric field formed by the electrodes is shielded in the electrolytic cell; and an electrolyte supply pipeline connected to the electrolytic cell and guiding an electrolyte to flow along the surface of the workpiece to be polished. The invention also discloses an electrochemical polishing method. The apparatus has a simple structure, and can solve the columnar stripes appearing on the surface of a base band, and the polishing method has the advantages of good polishing effect and fast polishing speed.
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Description

technical field

[0001] The present invention relates to an electrochemical polishing apparatus and method. Background technique

[0002] The high-temperature superconducting wire, represented by the second-generation ReBCO (Re=Y, or rare earth element), is composed of a variety of metal oxide films grown on a metal substrate. The performance of high-temperature superconducting wires depends entirely on the surface condition of the metal substrate and the growth characteristics of various metal oxide films. To obtain high-quality high-temperature superconducting wires, the surface of the metal substrate and the growth of various metal oxide films have very high requirements.

[0003] First, it is well known that in order for ReBCO metal oxides to exhibit superconducting properties, their ReBCO films must have the crystal structure of metal oxides, and this crystal structure must be biaxially oriented. That is, the space of each crystal forming the thin film must be consiste...

Examples

Embodiment Construction

[0040] The technical solutions in the embodiments of the present invention will be described in detail below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0041] ginseng figure 1 As shown, in this embodiment, the whole process can be divided into three main parts:

[0042] a. Pre-cleaning the workpiece to be polished before polishing;

[0043] b. Electrochemical polishing of workpiece to be polished;

[0044] c. Clean the polished workpiece after polishing.

[0045] Pre-cleaning of the workpiece to be polished before polishing: The purpose is to remove the surface impurities of the metal base belt (the workpiece to b...