Electrochemical polishing apparatus and method thereof

Abstract

The invention discloses an electrochemical polishing apparatus. The apparatus comprises: a tank body; at least one electrolytic cell horizontally penetrating through the tank body, wherein the electrolytic cell forms an inlet and an outlet at two ends of the tank body respectively, and a workpiece to be polished transversely moves in the electrolytic cell; electrodes positioned at two sides of the electrolytic cell, wherein an electric field formed by the electrodes is shielded in the electrolytic cell; and an electrolyte supply pipeline connected to the electrolytic cell and guiding an electrolyte to flow along the surface of the workpiece to be polished. The invention also discloses an electrochemical polishing method. The apparatus has a simple structure, and can solve the columnar stripes appearing on the surface of a base band, and the polishing method has the advantages of good polishing effect and fast polishing speed.

Description

technical field [0001] The present invention relates to an electrochemical polishing apparatus and method. Background technique [0002] The high-temperature superconducting wire, represented by the second-generation ReBCO (Re=Y, or rare earth element), is composed of a variety of metal oxide films grown on a metal substrate. The performance of high-temperature superconducting wires depends entirely on the surface condition of the metal substrate and the growth characteristics of various metal oxide films. To obtain high-quality high-temperature superconducting wires, the surface of the metal substrate and the growth of various metal oxide films have very high requirements. [0003] First, it is well known that in order for ReBCO metal oxides to exhibit superconducting properties, their ReBCO films must have the crystal structure of metal oxides, and this crystal structure must be biaxially oriented. That is, the space of each crystal forming the thin film must be consiste...

AI Technical Summary

Problems solved by technology

The first problem is residual particles on the base tape surface after polishing

The second problem is the columnar stripe structure that appears on the surface of the baseband

[0010] The shortcoming of above-mentioned technology is: 1. The method for solving the first problem is unreasonable

If the electrolysis process under the action of high current cannot remove particles or oil stains on the surface of the baseband, then the low-current electrolysis process set in the patent at the front end of the electropolishing will not do much

2. The method to solve the columnar stripes on the surface of the baseband is too complicated

Its disadvantage is that the polishing speed of the baseband is too slow (20 m / h), which cannot meet the needs of industrial production (requires at least 60 m / h)

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