A chip-to-chip interconnection device based on fpga
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
- Publication Date
- 2017-01-25
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Figure 1
Abstract
Description
Technical field
[0001] The invention relates to the technical field of chip interconnection, in particular to an FPGA-based inter-chip interconnection device. Background technique
[0002] FPGA (Field Programmable Gate Array) chip is a programmable logic device with short development cycle and high reliability.
[0003] There are many available technologies for the interconnection between chips. LVDS (Low-Voltage Differential Signaling) interface has the characteristics of low noise, low power consumption, high speed, and low cost. When the speed requirement is not too high (usually These chips do not integrate serdes (serializers), and are often used as interconnect interfaces between chips. In the existing technology, there is generally no LVDS interface with reliable data transmission and adjustable transmission rate. Summary of the invention
[0004] In order to solve the problems of the prior art, the present invention provides an FPGA-based inter-chip interconnection device, ...